Semiconductor Laser Module Reflecting Mirror Mounting
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Solution Overview
Problem
Conventional semiconductor laser modules face challenges in achieving high fiber optic coupling efficiency due to the limited adjustment range and accuracy of reflecting mirrors, which can lead to partial laser light obstruction and increased costs associated with stricter dimensional accuracy.
Innovation Solution
The semiconductor laser module incorporates reflecting mirrors fixed on an erect surface vertical to the semiconductor laser installation surfaces, allowing for precise adjustment and alignment, with features like grasping parts, curved bond surfaces, and concaved parts to enhance installation accuracy and prevent adhesive overflow, thereby ensuring effective laser light reflection and coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If reflecting mirrors are fixed on semiconductor laser installation surfaces with adhesive, then the structure is simple, but the vertical position accuracy deteriorates due to adhesive thickness variance and processing tolerance
Solution Approach 1:
The reflecting mirror is rotated 90 degrees and fixed on a side surface (erect surface) rather than the bottom surface, changing the mounting dimension from vertical to lateral. This eliminates the influence of adhesive thickness on vertical position accuracy while maintaining structural simplicity.
Solution Approach 2:
A grasping part (protrusion) is added to the reflecting mirror to enable precise positioning and adjustment during assembly. This copying feature allows for accurate alignment without relying solely on adhesive thickness control.
2Reliability
If the size of reflecting mirrors is increased to ensure full laser light reflection, then reflection coverage is improved, but the risk of light obstruction from adjacent mirrors increases
Solution Approach 1:
By mounting mirrors on vertical side surfaces at different heights corresponding to different laser installation surfaces, the patent creates spatial separation in the vertical dimension. This prevents light obstruction between adjacent mirrors while maintaining adequate reflection coverage for each laser.
Solution Approach 2:
Each reflecting mirror is sized and positioned specifically for its corresponding laser's light path, optimizing reflection coverage locally without unnecessarily increasing size that could cause obstruction to adjacent lasers.
3Reliability
If stricter dimensional accuracy is required for reflecting mirrors to prevent light obstruction, then light reflection reliability is improved, but production costs increase
Solution Approach 1:
Mounting mirrors on side surfaces rather than the bottom surface transfers the critical positioning dimension from vertical (sensitive to adhesive thickness) to lateral, allowing for more relaxed tolerance specifications and lower production costs while maintaining reflection reliability.
Solution Approach 2:
The side surface mounting structure serves multiple functions: it provides stable mechanical support, enables precise positioning through the grasping part, and simplifies assembly by eliminating the need for ultra-precise adhesive thickness control, thereby reducing overall manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures that laser light is consistently reflected and coupled to the optical fiber with high efficiency, preventing obstruction and reducing production costs by allowing for thinner mirrors and simpler packaging designs.
Implementation Method 1
a plurality of reflecting mirrors (11), which each reflect laser lights emitted from the plurality of semiconductor lasers
Implementation Method 2
a condensing lens (13), which concentrates the laser lights reflected by the plurality of reflecting mirrors and couples them to an optical fiber
Data Source
AI summary
A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.


