Laser Heating Module With Multi-Channel Cooling and Gas Protection
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Solution Overview
Problem
High-power laser devices face challenges with high power consumption, difficult heat dissipation, and large volume, limiting product development.
Innovation Solution
A high-power laser heating module with a heat sink block, drive circuit board, flexible circuit board, and laser fixtures thermally coupled to the heat sink block, combined with a centralized uniform heat dissipation device featuring a water supply and multi-waterway macro-channel mechanism, and a laser heating device with a gas-filling port for inert gas protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power laser chips are used to increase heating power, then heating capability is improved, but heat dissipation difficulty increases
Solution Approach 1:
The heat sink block is divided into multiple independent heat dissipation channels with separate water inlets and outlets. Each channel corresponds to a specific laser chip module, allowing independent heat dissipation pathways. This segmentation enables efficient heat removal from high-power laser chips by distributing thermal load across multiple controlled channels.
Solution Approach 2:
Different regions of the heat sink block are designed with locally optimized thermal conduction structures. The heat sink incorporates varying thickness regions, heat dissipation fins, and localized water channel densities matched to the thermal output of each laser chip position. This local quality optimization ensures that high-heat-generation areas receive enhanced heat dissipation capacity.
2Power
If multiple laser chips are integrated to increase power, then heating capability is improved, but device volume increases
Solution Approach 1:
Multiple laser chip modules are integrated onto a single heat sink block, merging their heat dissipation functions into one unified structure. The heat sink block serves as a common thermal management platform for all laser chips, eliminating the need for separate heat sinks for each chip. This merging approach consolidates device volume while maintaining high total power output.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement of laser chips on the heat sink block surface, optimizing their positional distribution. Laser chips are arranged in specific patterns (e.g., arrays or clusters) that maximize power density within the available footprint. The heat sink block's vertical dimension is also optimized with varying thickness and internal channel depth to accommodate multiple chips without increasing horizontal footprint.
3Ease of manufacture
If traditional heat dissipation structures are used, then manufacturing is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat sink block incorporates internal water channels that function as a liquid cooling system. Coolant flows through these channels to actively remove heat from the laser chip mounting regions. This hydraulic heat dissipation approach provides superior thermal management compared to passive conduction-only structures, while the channels are integrated into the heat sink block's manufacturing process.
Solution Approach 2:
The heat sink block is constructed from materials with high thermal conductivity (such as copper or aluminum alloys), potentially combined with other materials for structural support or thermal management. This composite approach optimizes both heat dissipation performance and manufacturability, balancing thermal efficiency with fabrication feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, reduces device volume, and ensures stable operation by minimizing external gas exposure, addressing the challenges of high power consumption and large size.
Implementation Method 1
a cooling water channel is arranged in the heat sink block
Implementation Method 2
a plurality of heat-conducting bosses are integrally formed on a top surface of the heat sink block
Implementation Method 3
a laser chip is arranged in each of the plurality of laser fixtures
Data Source
AI summary
Provided is a laser heating device, including: a housing, provided with an accommodating cavity, and an opening and a gas-filling port respectively communicating with the accommodating cavity; a laser assembly, arranged in the accommodating cavity, wherein the laser assembly comprises an irradiation member arranged corresponding to the opening, the irradiation member being capable of emitting light through the opening; and a heat dissipation unit, arranged in the accommodating cavity for dissipating heat from the irradiation member; wherein the gas-filling port is configured to be connected to a gas-filling device.