Optical Laser Module Substrates for Efficient TEC Thermal Isolation
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Solution Overview
Problem
Existing optical semiconductor modules face challenges in efficiently controlling the temperature of semiconductor laser elements, leading to increased power consumption and reduced temperature control efficiency due to high thermal resistance and heat transfer inefficiencies.
Innovation Solution
The optical semiconductor module incorporates a housing with a temperature control element, a high thermal conductivity AlN substrate, and a low thermal conductivity quartz substrate. The AlN substrate is in direct contact with the temperature control surface of the TEC, while the quartz substrate is mounted on the AlN substrate, creating a thermal path with controlled thermal resistance to manage heat transfer effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single substrate is used for mounting semiconductor laser elements, then the structure is simple, but temperature control efficiency is poor due to high thermal resistance
Solution Approach 1:
The substrate is divided into two separate layers: a AlN substrate for thermal management and a quartz substrate for electrical connections. This segmentation allows each substrate to specialize in its function, with the AlN substrate providing efficient heat conduction to the TEC and the quartz substrate providing stable electrical connections, thereby improving temperature control efficiency without compromising structural simplicity
Solution Approach 2:
The patent uses a composite substrate structure combining AlN (aluminum nitride) and quartz materials. The AlN substrate provides high thermal conductivity for efficient heat dissipation, while the quartz substrate provides electrical insulation and mechanical stability. This composite approach resolves the contradiction by achieving both excellent temperature control and structural simplicity through material optimization
2Use of energy by stationary object
If the TEC is directly exposed to the housing, then heat dissipation is efficient, but heat inflow and outflow between housing and TEC increases power consumption
Solution Approach 1:
The AlN substrate acts as an intermediary between the TEC and the housing. It provides a controlled thermal interface that manages heat flow, reducing unnecessary heat inflow from the housing to the TEC and improving the overall thermal management efficiency, thereby reducing TEC power consumption
Solution Approach 2:
The patent applies different thermal conductivity properties to different regions of the substrate structure. The AlN substrate has high thermal conductivity for efficient heat conduction from the laser element to the TEC, while the interface with the housing is designed to control heat flow. This local differentiation of thermal properties optimizes both temperature control and power consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly suppresses heat inflow and outflow between the housing and the TEC, reducing the power consumption of the TEC and enhancing the efficiency of temperature control for the semiconductor laser element, thereby improving overall module performance.
Implementation Method 1
a first board (substrate) mounted on the temperature control plane, the first board having a first side and a second side reverse to the first side, the first side having a surface contact with the temperature control plane, the first board having a first thermal conductivity
Implementation Method 2
a second board mounted on the second side of the first board, the second board having a third side and a fourth side reverse to the third side, the third side being fixed to the second side of the first board, the fourth side including a wiring pattern, the wiring pattern being electrically connected with the housing via a first bonding wire, the second board having a second thermal conductivity smaller than the first thermal conductivity
Data Source
AI summary
An optical semiconductor module according to an embodiment includes a housing; a temperature control element having a temperature control plane; a first board mounted on the temperature control plane; a semiconductor laser device mounted on the second side of the first board; a second board mounted on the second side of the first board, the second board having a third side and a fourth side, the fourth side including a wiring pattern, the wiring pattern being electrically connected with the housing via a first bonding wire and electrically connected to the semiconductor laser device via a second bonding wire, the second board having a second thermal conductivity smaller than the first thermal conductivity. The housing is configured to accommodate the temperature control element, the first board, the second board, and the semiconductor laser device.