Laser Emission Module Thermal Layout for Compact LiDAR Heat Dissipation
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Solution Overview
Problem
High power consumption in laser emitters leads to excessive heat generation, which if not dissipated timely, affects the normal functioning and performance of LiDAR systems.
Innovation Solution
A laser emission module with a heat conduction substrate that absorbs and quickly transmits heat to a support board or heat dissipation structure, ensuring efficient heat dissipation without the need for a large heat conduction substrate, thereby maintaining the laser emitter's performance and reducing overall volume and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large heat conduction substrate is used to dissipate heat from the laser emitter, then heat dissipation effectiveness is improved, but the overall volume and production costs of the laser emission module increase
Solution Approach 1:
The patent applies local quality by placing a heat conduction substrate only at the specific location where the laser emitter is mounted, rather than using a large substrate across the entire support board. The heat conduction substrate is positioned locally corresponding to the mounting region of the first support board, concentrating heat dissipation resources exactly where needed - at the heat-generating laser emitter - thereby achieving effective heat dissipation without unnecessarily increasing the overall volume of the module.
Solution Approach 2:
The patent extracts the heat conduction function from the entire support board structure and isolates it to a separate, smaller heat conduction substrate component. This allows the heat conduction substrate to be precisely sized and positioned only where heat dissipation is needed, rather than requiring the entire support board to serve as a heat sink. The heat conduction substrate can be optimally designed for its specific function without being constrained by the overall board dimensions.
2Temperature
If a large heat conduction substrate is used to dissipate heat from the laser emitter, then heat dissipation effectiveness is improved, but production costs increase
Solution Approach 1:
The patent applies local quality by placing a heat conduction substrate only at the specific location where the laser emitter is mounted, rather than using a large substrate across the entire support board. The heat conduction substrate is positioned locally corresponding to the mounting region of the first support board, concentrating heat dissipation resources exactly where needed - at the heat-generating laser emitter - thereby achieving effective heat dissipation without unnecessarily increasing the overall volume of the module.
Solution Approach 2:
The patent extracts the heat conduction function from the entire support board structure and isolates it to a separate, smaller heat conduction substrate component. This allows the heat conduction substrate to be precisely sized and positioned only where heat dissipation is needed, rather than requiring the entire support board to serve as a heat sink. The heat conduction substrate can be optimally designed for its specific function without being constrained by the overall board dimensions.
3Device complexity
If heat is not transmitted timely from the laser emitter, then the structure remains simple, but the laser emitter performance and stability deteriorate
Solution Approach 1:
The patent introduces a heat conduction substrate as an intermediary component between the laser emitter and the support board. This substrate acts as a thermal mediator that efficiently conducts heat away from the laser emitter's active region. The heat conduction substrate serves as a dedicated thermal pathway, separating the heat dissipation function from the mechanical support function, thereby ensuring reliable heat transmission without complicating the overall structure.
Solution Approach 2:
The patent segments the heat dissipation function from the mechanical support function by introducing a separate heat conduction substrate layer. This segmentation allows each component to be optimized for its specific purpose - the support board provides mechanical stability while the heat conduction substrate provides thermal management. The segmented structure ensures timely heat transmission while maintaining overall structural simplicity through functional separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transmits heat away from the laser emitter, improving detection performance and stability by preventing heat accumulation, thus enhancing the operational efficiency of LiDAR systems.
Implementation Method 1
the heat conduction substrate is designed to absorb the heat generated by the laser emitter during working, and therefore, the heat generated by the laser emitter during working can be quickly transmitted to the heat conduction substrate, and then the heat conduction substrate quickly transmits the heat to the first support board or a heat dissipation structure
Data Source
AI summary
This application discloses a laser emission module and a LIDAR. The laser emission module includes: a laser emitter, a heat conduction substrate including a first board surface, and a first support board including a third board surface facing toward the laser emitter. The first board surface is configured to connect the laser emitter. The third board surface has a mounting region. The heat conduction substrate corresponding to the mounting region is mounted on the first support board.