Semiconductor Laser Module Thermal Shielding for Coupling Stability
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Solution Overview
Problem
Existing semiconductor laser modules face challenges in maintaining a consistent coupling ratio of output light from the semiconductor laser element to the optical fiber, leading to variations in laser beam output due to thermal expansion and distortion of the housing.
Innovation Solution
A semiconductor laser module design that incorporates a thin plate to shield the top and side walls of the housing from stray light and heat, preventing thermal expansion and maintaining the alignment of the laser beam with the optical fiber, coupled with a three-dimensional laminating and shaping apparatus utilizing this module to ensure precise laser beam delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor laser element is coupled to the optical fiber using a conventional housing structure, then the assembly is simple to manufacture, but the coupling ratio of output light varies due to thermal expansion and distortion
Solution Approach 1:
The housing is divided into a first housing and a second housing that are coupled together, with the thin plate positioned between them. This segmentation allows the thin plate to serve as a thermal barrier while maintaining the structural integrity needed for stable coupling between the semiconductor laser element and optical fiber.
Solution Approach 2:
A thin plate is introduced as an intermediary component between the semiconductor laser element and the housing. This thin plate acts as a thermal barrier that prevents heat from the laser element from causing thermal expansion and distortion in the housing, thereby stabilizing the coupling ratio without interfering with the optical coupling function.
2Stability of the object's composition
If the housing is shielded from stray light and heat using a thin plate, then thermal expansion and distortion are prevented, but the device complexity increases
Solution Approach 1:
The thin plate is positioned specifically at the top and side walls of the housing where thermal exposure occurs, providing localized thermal protection. This targeted approach shields critical areas from heat-induced distortion while minimizing the overall addition to device complexity.
Solution Approach 2:
The housing structure combines different materials with complementary properties: the thin plate provides thermal barrier functionality, while the first and second housing materials provide structural support and optical transparency. This composite structure achieves both thermal stability and mechanical strength.
3Productivity
If the semiconductor laser element is directly coupled to the optical fiber without thermal shielding, then the device structure is simple, but the laser beam output varies due to thermal effects
Solution Approach 1:
The thin plate serves as a thermal intermediary that blocks heat transfer from the semiconductor laser element to the housing, preventing thermal expansion and distortion that would otherwise cause variations in laser beam output and coupling ratio.
Solution Approach 2:
The thin plate is installed in advance as a preventive measure against thermal effects. By positioning the thermal barrier before thermal exposure occurs, the design prevents dimensional changes and coupling ratio variations rather than correcting them after they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses variations in the coupling ratio of the output light, maintaining a stable laser beam output and preventing distortion of the housing, thereby ensuring consistent performance and accuracy in the three-dimensional laminating and shaping process.
Implementation Method 1
a thin plate 103 is provided between the semiconductor laser elements 101 and the top 151... the thin plate 103 is arranged to shield the top 151 and the side walls 141, 142, 143 from stray light and heat
Implementation Method 2
condensing a laser beam emitted from a semiconductor laser element through a condenser lens to enter an optical fiber
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.