Laser Processing Apparatus Mount Member Irregular Reflection
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Solution Overview
Problem
Existing laser processing apparatuses face challenges in reliably distinguishing between the workpiece and the mount member of the holding table, leading to potential damage from laser beams and safety hazards due to similar reflectivity of light intensity.
Innovation Solution
The apparatus includes a holding table with a suction-held workpiece and an annular mount member with an irregularly treated surface for distinct light reflection, allowing the detection system to differentiate and prevent laser application to the mount member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the detection system uses return light intensity to distinguish workpiece from mount member, then workpiece detection is enabled, but the mount member cannot be differentiated when reflectivity is similar, causing laser beam misapplication
Solution Approach 1:
The mount member is given a specific surface property (low reflectivity) that differs from the workpiece surface. This local quality difference in light reflection characteristics enables the detection system to reliably distinguish between the mount member and workpiece based on return light intensity, preventing laser beam misapplication to the mount member.
2Strength
If the mount member has a smooth surface, then it provides good structural support, but it reflects light similarly to the workpiece, causing detection failure
Solution Approach 1:
The mount member surface is treated to have a specific local quality (rough surface with low reflectivity) that differs from the workpiece surface. This enables the detection system to distinguish between the two components based on light reflection characteristics while the mount member maintains its structural support function.
Solution Approach 2:
The surface of the mount member is modified to change its optical properties (light reflection characteristics). By creating a rough surface that scatters light differently, the mount member presents a distinct optical signature to the detection system, enabling reliable differentiation from the workpiece.
3Ease of operation
If the laser beam is applied to the mount member by mistake, then the detection system failed to differentiate, but this causes damage to the holding table and safety hazards
Solution Approach 1:
The mount member surface is pre-treated to have low reflectivity before the laser processing operation. This preliminary modification creates a distinct optical signature that enables the detection system to identify and avoid the mount member, preventing harmful laser beam application in advance.
Solution Approach 2:
The mount member is given a specific surface property (rough texture with scattered light reflection) that creates a detectable difference from the workpiece. This local quality difference enables the automated detection system to reliably identify the mount member and prevent laser beam misapplication, ensuring safety while maintaining automatic operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures accurate detection and prevents laser beam application to the mount member, thereby preventing damage to the apparatus and ensuring operator safety while ensuring proper application to the workpiece.
Implementation Method 1
the mount member having an upper surface treated by an irregular reflection process for irregularly reflecting light
Implementation Method 2
detecting whether or not the workpiece is present at a laser beam applying position according to the intensity of return light reflected from the workpiece
Implementation Method 3
a pulsed laser beam having a transmission wavelength to the wafer is applied to the wafer from one side thereof in the condition where the focal point of the pulsed laser beam is set inside the wafer, thereby continuously forming a modified layer inside the wafer along each division line
Implementation Method 4
applying a pulsed laser beam having an absorption wavelength to the workpiece along the division lines to thereby form a laser processed groove on the workpiece along each division line by ablation
Data Source
AI summary
A laser processing apparatus includes a holding table for holding a workpiece, a laser beam applying unit for applying a laser beam to the workpiece, a feeding mechanism for relatively moving the holding table and the laser beam applying unit, a detector for applying detection light to the workpiece and detecting the quantity of reflected light obtained by the reflection of the detection light from the workpiece, and a controller for determining whether or not the workpiece is present at a laser beam applying position according to a detection signal output from the detector. The holding table includes a holding member for holding the workpiece under suction and an annular mount member provided so as to surround the holding member for mounting the holding member. The mount member has an upper surface treated by an irregular reflection process for irregularly reflecting light.