Semiconductor Laser Heat Dissipation via Mounting Body Spacing
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Solution Overview
Problem
The challenge is to achieve stable heat dissipation in semiconductor laser devices due to the difficulty in aligning the lowermost surfaces of the mounting member and the substrate on the same plane, caused by differences in thermal expansion coefficients, which affects the heat dissipation properties and leads to variations in device performance.
Innovation Solution
The semiconductor laser device design includes a base body with a recess and a through portion, where the lowermost surface of the mounting body is spaced apart from the base body, allowing for efficient heat dissipation and venting of gas voids in the bonding material, thereby maintaining stable heat dissipation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the lowermost surfaces of the mounting member and substrate are arranged on the same plane to achieve excellent heat dissipation, then heat dissipation properties are improved, but manufacturing precision deteriorates due to difficulty in alignment caused by different coefficients of thermal expansion
Solution Approach 1:
The patent introduces a mounting member as an intermediary component between the semiconductor laser element and the substrate. This mounting member has a lowermost surface that contacts the substrate, while the semiconductor laser element is mounted on its upper surface. This intermediary structure decouples the alignment requirement from the heat dissipation path, allowing the mounting member's lowermost surface to be precisely aligned with the substrate while the semiconductor laser element can be mounted with standard precision.
Solution Approach 2:
The patent segments the heat dissipation path into distinct functional zones: the mounting member's lowermost surface provides the primary heat dissipation interface with the substrate, while the upper surface provides the mounting interface for the semiconductor laser element. This segmentation allows each surface to be optimized independently - the lowermost surface for thermal contact and the upper surface for electrical and mechanical connection.
2Temperature
If the lowermost surfaces of the mounting member and substrate are arranged on the same plane to achieve excellent heat dissipation, then heat dissipation properties are improved, but device complexity increases due to the difficulty in achieving precise alignment
Solution Approach 1:
The mounting member serves as a mediator that simplifies the overall device structure by consolidating the alignment function to its lowermost surface only. The upper surface of the mounting member can have standard mounting features without requiring precise alignment, thus reducing the overall device complexity while maintaining excellent heat dissipation through the lowermost surface contact.
3Manufacturing precision
If the lowermost surface of the mounting member is spaced apart from the lowermost surface of the substrate, then alignment complexity is reduced, but heat dissipation properties deteriorate
Solution Approach 1:
The patent applies local quality by making only the lowermost surface of the mounting member have high precision flatness and thermal conductivity for optimal heat dissipation contact with the substrate. Other surfaces of the mounting member can have standard manufacturing quality, thus achieving excellent heat dissipation without requiring high precision throughout the entire mounting member structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures consistent and improved heat dissipation, reducing temperature increases and extending the lifetime of the semiconductor laser device by allowing direct contact with external heat dissipation and preventing impairments from gas voids in the bonding material.
Implementation Method 1
a mounting body on which the semiconductor laser element is mounted, and a base body connected to the mounting body... excellent heat dissipation is possible if the lowermost surface of the mounting member and the lowermost surface of the substrate can be arranged on the same plane
Implementation Method 2
The mounting member and the substrate are connected with one another by using a solder material and applying heat
Implementation Method 3
due to a difference in the coefficient of thermal expansion between the mounting member and the substrate, the lowermost surface of the mounting member and the lowermost surface of the substrate tend to be on different planes
Data Source
Figure 1~3
Figure 4~5
AI summary
A semiconductor laser device having stable heat dissipation property is provided. The semiconductor laser device 100 includes a semiconductor laser element 10, a mounting body 30 on which the semiconductor laser element 10 is mounted, and a base body 40 connected to the mounting body 30. The base body 40 has a recess configured to engage with the mounting body 30 and a through portion penetrating through a part of a bottom of the recess. In the specification, the remainder, which is a part of the bottom of the recess except for the through portion has a thickness equal or less than alf of the largest thickness of the base body 40. The lowermost surface of the mounting body 30 is spaced apart from the lowermost surface of the base body 40 through the remainder.