Laser Nozzle Focus Positioning for Stable Thick-Plate Cutting

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Solution Overview

Problem

The existing laser machining apparatus requires additional optical components to form a ring-shaped laser beam, leading to frequent machining defects and deterioration in machining quality due to contamination and thermal lens effects.

Innovation Solution

A laser machining apparatus with a laser oscillator outputting 1 μm wavelength light, a machining head featuring a divergent-shaped nozzle and a condensing lens, and a controller that controls the focus position inside the machining head, away from the nozzle's smallest inner diameter, emitting laser light and machining gas coaxially without forming a ring beam.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a ring-shaped laser beam is formed using additional optical components, then thick workpieces can be cut, but machining quality deteriorates due to contamination and thermal lens effects

Engineering Contradiction:
Improveworkpiece thicknessVSAvoidmachining quality
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent removes the ring beam forming optical components from the system entirely. Instead of using a ring beam, the invention employs a Gaussian beam with a specific focus position inside the workpiece that achieves effective thick workpiece cutting without the contamination and thermal lens problems associated with ring beam optical components

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the focus position parameter to be inside the workpiece (positive focus position) rather than at the surface or outside. This parameter change allows the Gaussian beam to effectively process thick workpieces by creating a focused energy distribution deep within the material, eliminating the need for ring beam geometry

Inventive Principle:
Principle #35Parameter changes

2Length of moving object

If additional optical components are added to form a ring beam, then thick workpiece cutting capability is achieved, but device complexity increases

Engineering Contradiction:
Improveworkpiece thicknessVSAvoidoptical system complexity
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent extracts and removes the ring beam forming optical components (such as cylindrical lenses or holographic elements) from the optical system. The simplified system uses only a standard condensing lens to focus a Gaussian beam, significantly reducing device complexity while maintaining thick workpiece cutting capability through internal focusing

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The condensing lens in the patent serves multiple functions: it focuses the Gaussian beam to a point inside the workpiece for cutting, and its position can be adjusted to adapt to different workpiece thicknesses. This universal component replaces the need for specialized ring beam forming optics

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Length of moving object

If additional optical components are used to form a ring beam, then thick workpiece cutting is enabled, but reliability decreases due to frequent contamination

Engineering Contradiction:
Improveworkpiece thicknessVSAvoidmachining stability
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

By removing the ring beam forming optical components that are positioned close to the workpiece, the patent eliminates the sources of contamination (dust, spatter, molten material) that would deposit on these components. The simplified optical path with fewer components near the machining zone significantly improves reliability and reduces maintenance requirements

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Stably cuts thick workpieces with high quality, reducing machining defects and maintaining stability across varying material compositions and surface states without the need for a special optical system, thus improving manufacturing efficiency and cost-effectiveness.

Implementation Method 1

a condensing lens to condense the laser light at a focus position

Methodology Applied
Scientific EffectCondensing lens focusing: Lens

Implementation Method 2

machining a workpiece by irradiating the workpiece with laser light

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 3

ejects an oxygen gas along a ring axis of the ring-shaped laser beam

Methodology Applied
Scientific EffectOxidation reaction: Oxidation

Data Source

PatentUS20240278352A1Laser machining apparatus and laser machining method
Publication Date: 2024.08.22 MITSUBISHI ELECTRIC CORP
  • US20240278352A1 patent drawing
  • US20240278352A1 patent drawing
  • US20240278352A1 patent drawing

AI summary

A laser machining apparatus includes a laser oscillator, a machining head, and a controller. The laser oscillator outputs laser light. The machining head includes: a nozzle having a divergent-shape on an outlet side thereof through which the laser light is emitted to a workpiece; and a condensing lens that condenses the laser light at a focus position. The machining head ejects machining gas to the workpiece and ejects cooling gas to the nozzle through a path different from a path for the machining gas. The controller controls the focus position of the laser light such that the focus position is located inside the machining head and away from a smallest-inner-diameter portion of the nozzle in a direction toward the condensing lens. The laser light is emitted to the workpiece without a ring beam being formed. The machining gas is ejected to the workpiece coaxially with the laser light.