Laser Onion Skin Cutting to Protect the Edible Layer
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Solution Overview
Problem
Existing onion skin removal devices often damage the edible part of the onion and require frequent blade cleaning and replacement, complicating handling.
Innovation Solution
A method and device using a laser with a wavelength of 300 to 500 nm to selectively cut the onion skin, followed by removal of the cut skin, utilizing air-blowing means for efficient skin removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a blade is used to cut the outer skin of the onion, then the outer skin can be removed, but the edible part is also damaged and the blade requires frequent cleaning and replacement
Solution Approach 1:
The patent replaces the mechanical blade cutting system with a laser irradiation system. The laser beam selectively cuts the outer skin through optical energy absorption without physical contact, eliminating the need for blade cleaning and replacement while preventing damage to the edible part through precise wavelength selection (300-500 nm) that targets the outer skin's absorption characteristics
2Productivity
If a blade is used to cut the outer skin of the onion, then the outer skin can be removed, but the blade requires frequent cleaning and replacement, complicating device handling
Solution Approach 1:
The patent replaces the mechanical blade system with a laser irradiation system that requires no physical contact with the onion. The laser beam is directed through optical components that can be easily adjusted and cleaned, eliminating the complex blade replacement and cleaning procedures, thereby simplifying device operation and maintenance
Solution Approach 2:
The patent introduces an optical system as an intermediary between the energy source and the onion outer skin. This optical intermediary (lens, mirror, or optical fiber) allows precise control of the cutting beam without requiring mechanical contact, simplifying the overall device structure and operation while maintaining high cutting efficiency
3Loss of substance
If a laser with wavelength 300 to 500 nm is used to selectively cut the outer skin, then the edible part is protected from damage, but the device complexity increases
Solution Approach 1:
The patent utilizes the specific parameter of laser wavelength (300-500 nm) to achieve selective cutting. By selecting this wavelength range that matches the absorption characteristics of the outer skin pigments, the system can differentiate between outer skin and edible part, enabling selective removal without damage to the edible portion while using commercially available laser technology
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and device effectively remove onion skin while minimizing damage to the edible part and eliminate the need for blade maintenance.
Implementation Method 1
irradiating the outer skin of the onion with a laser under conditions that enable selective cutting of the outer skin
Implementation Method 2
The wavelength of the laser is 300 to 500 nm, which corresponds to the absorption spectrum of the outer skin
Data Source
AI summary
The present invention provides a method for removing an outer skin of an onion and a device for removing an outer skin of an onion that can easily remove the outer skin of the onion and suppress damage to the edible part when the outer skin is removed. A method for removing an outer skin of an onion according to the present invention comprises step A of irradiating the outer skin of the onion with a laser under conditions that enable selective cutting of the outer skin, and making a cut in the outer skin; and step B of removing the outer skin with the cut from the onion, wherein the wavelength of the laser is 300 to 500 nm.