Laser Opening Formation in Display Substrates
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Solution Overview
Problem
The manufacturing process for display apparatuses with openings faces challenges in reducing damage to the process region and improving production yield and quantity, as increased delay times in laser beam operations lead to decreased efficiency.
Innovation Solution
A method involving alternating and repeated first and second scan operations with a laser beam along different unit paths, overlapping and varying in shape and length, to form openings in the display apparatus, minimizing thermal damage and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If delay time is increased after laser beam operation, then thermal damage to process region is reduced, but production yield rate and production quantity decrease
Solution Approach 1:
The opening formation process is segmented into multiple scan operations (first scan operation, second scan operation, and optionally third scan operation) with different unit paths. Each scan operation processes different portions of the opening area, allowing thermal energy to dissipate between scans on overlapping regions, thereby reducing cumulative thermal damage while maintaining production efficiency.
Solution Approach 2:
The method employs periodic alternation between different scan operations with distinct unit paths. By periodically switching between first scan operation (with first unit paths) and second scan operation (with second unit paths), the process allows thermal effects to subside between periodic exposures to the same area, reducing thermal damage without requiring excessive delay times that would reduce productivity.
2Productivity
If single scan operation is used to form opening, then production efficiency is maintained, but thermal damage to process region increases
Solution Approach 1:
The single scan operation is divided into multiple scan operations (first scan operation, second scan operation, and optionally third scan operation), each with different unit paths. This segmentation distributes the thermal load across multiple passes, reducing peak thermal damage to the process region while maintaining overall production efficiency through systematic coverage of the opening area.
Solution Approach 2:
Different scan operations utilize different unit paths that vary in their spatial arrangement and coverage patterns. By introducing dimensional variation in the scan paths (different trajectories, overlapping regions, and coverage patterns), the method reduces concentrated thermal exposure while maintaining productivity through comprehensive area coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces thermal damage and increases production yield and quantity by minimizing thermal effects during the process, allowing for precise and efficient formation of openings in display apparatuses.
Implementation Method 1
performing a first scan operation, whereby a laser beam is irradiated onto an edge of the opening area in a direction of the substrate along a plurality of first unit paths; and performing a second scan operation, whereby the laser beam is irradiated onto the edge of the opening area in the direction of the substrate along a plurality of second unit paths that are different from the plurality of first unit paths
Data Source
AI summary
A method of manufacturing a display apparatus includes: forming a plurality of display devices in a display area of a substrate including an opening area and the display area surrounding the opening area; and forming an opening in the opening area, wherein the forming of the opening includes: performing a first scan operation, whereby a laser beam is irradiated onto an edge of the opening area in a direction of the substrate along a plurality of first unit paths; and performing a second scan operation, whereby the laser beam is irradiated onto the edge of the opening area in the direction of the substrate along a plurality of second unit paths that are different from the plurality of first unit paths.