Laser Material Processing with Overlapping Interaction Zones

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Solution Overview

Problem

Existing laser surgical methods for producing curved cut surfaces in materials, such as in ophthalmic operations, require precise localization of laser beams to avoid collateral damage and often rely on defined sequences of optical breakthroughs to prevent plasma bubble joining, which complicates the cutting process and increases the risk of incomplete cuts.

Innovation Solution

The solution involves controlling the distance between centers of interaction to be ≤10 μm and reducing pulse fluence to below 5 J/cm², allowing for overlapping zones of interaction to achieve material separation without forming large plasma bubbles, and dividing the cut surface into finer and coarser portions for improved visibility and precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If defined sequences of optical breakthroughs are used to prevent plasma bubble joining, then cut quality is improved, but process complexity and risk of incomplete cuts increase

Engineering Contradiction:
Improvecut qualityVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the parameter of center-to-center distance to ≤10 μm and pulse fluence to below 5 J/cm², which fundamentally alters the interaction mechanism from sequential optical breakthroughs to overlapping nonlinear optical absorption zones, eliminating the need for complex defined sequences while maintaining cut quality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent merges adjacent zones of interaction by reducing the distance between centers to ≤10 μm, causing the zones to overlap and combine into a continuous modified region. This merging eliminates the need for defined sequences between discrete optical breakthroughs, simplifying the process while ensuring complete material separation

Inventive Principle:
Principle #5Merging (Combining)

2Object-affected harmful factors

If precise localization of laser beams is used to avoid collateral damage, then tissue safety is improved, but equipment complexity and operational difficulty increase

Engineering Contradiction:
Improvecollateral damageVSAvoidequipment complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent changes the fluence parameter to below 5 J/cm² and center distance to ≤10 μm, creating overlapping zones that confine the nonlinear optical absorption effect precisely to the intended path. This precise parameter control achieves localization without requiring complex beam positioning systems

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent transitions from precise lateral beam positioning to precise control of the focus depth and zone overlap in the longitudinal dimension. By controlling the axial position and overlap of focal zones, the patent achieves three-dimensional confinement of the interaction volume, simplifying lateral positioning requirements

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If higher pulse fluence is used to ensure optical breakthrough, then material separation is improved, but plasma bubble formation and hazards increase

Engineering Contradiction:
Improvematerial separationVSAvoidplasma bubble formation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent inverts the conventional approach by reducing fluence below 5 J/cm² and using overlapping zones instead of high-fluence optical breakthroughs. This parameter change eliminates plasma bubble formation while achieving material separation through cumulative nonlinear optical absorption in the overlapping regions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies partial action by using sub-threshold fluence levels that individually do not cause optical breakthrough or plasma formation, but collectively achieve complete material separation when multiple overlapping zones are applied. This partial action approach eliminates harmful plasma bubbles while maintaining effective cutting

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the complexity of equipment, decreases personnel hazards, and enables the use of lower hazard class lasers, achieving high-quality cuts with reduced plasma bubble formation and increased precision, while allowing for smoother and more recognizable cut surfaces during surgical procedures.

Implementation Method 1

The laser pulse energy is usually selected such that an optical breakthrough in the tissue forms in the zone of interaction

Methodology Applied
Scientific EffectOptical breakdown:

Implementation Method 2

First, the optical breakthrough generates a plasma bubble in the material

Methodology Applied
Scientific EffectPlasma formation: Plasma

Implementation Method 3

If a plasma is generated at a material interface which may even be located within a material structure, material removal is effected from said interface. This is then referred to as photoablation

Methodology Applied
Scientific EffectPhotoablation: Laser Ablation

Data Source

PatentUS11033980B2Device and method for material processing by means of laser radiation
Publication Date: 2021.06.15 CARL ZEISS MEDITEC AG
  • US11033980B2 patent drawing
  • US11033980B2 patent drawing
  • US11033980B2 patent drawing

AI summary

A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≤10 μm from each other.