Laser-Oxidized Heat Sink Surface for Higher Thermal Emission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat sinks for electronic components, particularly light-emitting diodes in automotive lighting, face challenges in efficiently dissipating heat while maintaining cost-effectiveness and simplicity in manufacturing, as current methods like surface treatments and geometric modifications are complex and expensive.
Innovation Solution
A heat sink with a metal oxide surface layer formed by pulsed laser treatment, creating nodules that enhance radiative properties and geometric surface roughness, allowing for improved heat dissipation without additional layers or complex processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If geometric approaches (adding fins) are used to increase heat exchange surface, then heat dissipation is improved, but the size of the heat sink increases and manufacturing complexity increases
Solution Approach 1:
The invention changes the physical-chemical parameters of the heat sink surface by forming a metal oxide layer through anodization or chemical oxidation. This transforms the surface properties to enhance radiative heat emission without altering the overall geometry or adding fins, thereby improving heat dissipation while maintaining simple manufacturing processes
Solution Approach 2:
The invention applies surface oxidation treatments (anodization or chemical oxidation) that change the surface color and optical properties of the heat sink. The formed metal oxide layer has different radiative properties than the base metal, enhancing thermal radiation in the infrared spectrum and improving heat dissipation efficiency
2Power
If surface treatments (cataphoresis, anodization, physical vapor deposition) are used to improve radiative properties, then heat dissipation is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The invention uses simple chemical oxidation or anodization processes that change the surface parameters of the heat sink by forming a metal oxide layer. These processes are much simpler and more cost-effective than physical vapor deposition or plasma treatments, while still achieving enhanced radiative properties and improved heat dissipation
Solution Approach 2:
The invention employs inexpensive chemical reagents and simple oxidation processes instead of expensive vacuum deposition equipment or plasma treatment systems. The surface treatment can be performed using readily available chemicals and standard manufacturing equipment, significantly reducing manufacturing costs
3Power
If a metal oxide surface layer is formed by pulsed laser treatment, then radiative properties and surface roughness are enhanced, but additional processing steps are required
Solution Approach 1:
The invention replaces conventional chemical or electrochemical surface treatment methods with pulsed laser treatment. The laser creates a controlled plasma environment that oxidizes the metal surface and forms a roughened metal oxide layer. This substitution provides better control over surface morphology and radiative properties while potentially integrating the process into existing manufacturing lines
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat sink achieves significant increases in thermal emission and heat dissipation power, reducing costs and manufacturing complexity, while being applicable to finished products without additional cooling steps or surface preparation.
Implementation Method 1
at least a portion of the outer layer (100) comprises a surface layer (101) having a radiatively exposed surface (101a) and a layer immediately underlying the surface layer (102)... formed by pulsed laser treatment
Implementation Method 2
the surface layer (101) is made of an oxide of said material
Implementation Method 3
the surface layer (101) has an average thickness of between 5 μm and 30 μm... increases the emissivity of the radiative surface in the visible and infrared
Data Source
Figure 1~3
Figure 4
Figure 5A~5B
AI summary
Heat sink for electronic component and associated manufacturing method. The invention relates to a heat sink for an electronic component and to a method of manufacturing same by applying a nanopulsed laser. The heat sink comprises a body (10) equipped with an outer layer (100) comprising a surface layer (101) having a radiative exposed surface (101a) and a layer (102) lying directly under the surface layer (101). The underlying layer (102) is made of a metal-based material, and the surface layer (101) is based on an oxide of said material. The outer layer (100) comprises juxtaposed nodules (103). The heat sink uniquely combines a surface chemical state that promotes heat emission and a structure that geometrically promotes heat exchange in order to synergistically improve its heat-dissipating power.