Laser Package Array Sealing to Suppress Gas Leakage
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Solution Overview
Problem
Existing light-emitting devices with multiple semiconductor laser elements sealed collectively face challenges in suppressing gas leakage, leading to potential defects and reduced optical characteristics due to atmospheric reactions.
Innovation Solution
A light-emitting device design where each semiconductor laser element is individually sealed within a package with a reflection member and a sealed space, using a base plate and lens array configuration to minimize gas leakage and stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple semiconductor laser elements are sealed collectively in one hermetically sealed space, then the device structure is simpler and manufacturing is easier, but gas leakage occurs more frequently leading to defects and reduced reliability
Solution Approach 1:
The patent divides the hermetically sealed space into multiple independent sealed spaces, with each semiconductor laser element housed in its own separate sealed environment. This segmentation prevents gas leakage in one element from affecting other elements, thereby improving reliability while maintaining manufacturing feasibility through modular assembly.
2Device complexity
If multiple semiconductor laser elements are sealed collectively, then the device structure is simpler, but stress concentration occurs leading to increased leakage and defects
Solution Approach 1:
By separating each semiconductor laser element into its own independent sealed space within the package, the patent eliminates stress concentration that would occur in a collectively sealed structure. Each sealed space can expand and contract independently, preventing stress-induced leakage while maintaining a relatively simple overall package structure.
3Reliability
If semiconductor laser elements are individually sealed in separate packages, then gas leakage is suppressed and reliability improves, but the device structure becomes more complex and manufacturing becomes more difficult
Solution Approach 1:
The patent combines multiple individually sealed semiconductor laser elements into a single integrated package structure. This merging approach maintains the reliability benefits of individual sealing while simplifying manufacturing by allowing all elements to be mounted and connected on a common substrate within one package, rather than requiring separate assembly operations for each element.
4Reliability
If semiconductor laser elements are individually sealed, then leakage is suppressed and optical characteristics are maintained, but the device structure becomes more complex
Solution Approach 1:
The patent integrates multiple individually sealed semiconductor laser elements within a single package housing, combining them into one unified device structure. This approach preserves the reliability advantages of individual sealing while avoiding the complexity of completely separate packages, as all elements share common mounting and connection infrastructure within the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses gas leakage and reduces the occurrence of defects, enhancing the reliability and optical performance of the light-emitting device by isolating each element and distributing heat dissipation efficiently.
Implementation Method 1
a reflection member that reflects light outputted from the light-emitting element
Data Source
AI summary
A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.