Semiconductor Laser Package Recess Structure for Optical Axis Alignment

The patent applies preliminary action by forming a recessed portion in the upper surface of the base before mounting the semiconductor laser element. This recessed portion is pre-formed to precisely accommodate the laser element, ensuring that the optical axis aligns with the designed optical axis. The pressing step creates this recessed portion in advance, so that when the laser element is mounted, it automatically achieves precise optical axis alignment without requiring complex post-adjustment procedures.

The patent applies self-service by designing a structure where the lead terminals themselves serve as the pressing tool to form the recessed portion. The pressing step utilizes the gap between the lead terminals to apply pressure and create the recessed portion that accommodates the semiconductor laser element. This eliminates the need for separate complex alignment tools or multiple processing steps, as the existing lead terminal structure is repurposed to achieve precise optical axis alignment.

The patent applies merging by combining the formation of the recessed portion with the existing mounting process. The pressing step that creates the recessed portion is integrated into the manufacturing flow, and the lead terminals serve dual purposes: as electrical connections and as the pressing mechanism. This consolidation of functions reduces the need for separate alignment and mounting operations, thereby improving manufacturing efficiency while maintaining high optical axis alignment precision.