Integrated Laser Package Base for Compact Chip Assembly
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Solution Overview
Problem
The complexity and large size of existing laser chip packaging manufacturing processes hinder the further development of laser chip packaging technology.
Innovation Solution
A laser packaging device with an integrated base, laser light source assembly, lead wire, and light window, where the base includes a light source mounting portion and support portion forming an accommodating cavity, and the lead wire's configuration allows for miniaturization by simplifying the manufacturing process and reducing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the base includes separately provided light source mounting portion and support portion, then the manufacturing process is more complex, but the structural stability is improved
Solution Approach 1:
The light source mounting portion and support portion are merged into a single integrated base structure. This integration simplifies the manufacturing process by reducing the number of separate components that need to be produced and assembled, while the integrated design maintains structural stability through the unified configuration of the base that provides both mounting and support functions simultaneously.
2Volume of moving object
If the lead wire is configured to pass through the support portion with ends in accommodating cavity and bottom surface, then the device size is reduced, but the manufacturing complexity increases
Solution Approach 1:
The lead wire is configured to extend in multiple dimensions, with one end positioned in the accommodating cavity and the other end extending to the bottom surface of the base. This multi-dimensional arrangement allows the lead wire to efficiently connect the laser light source assembly to external circuits while minimizing the horizontal footprint of the device, thereby reducing overall device size without requiring excessive vertical space.
3Power
If multiple laser light source assemblies are provided at intervals, then the laser output capability is improved, but the device size increases
Solution Approach 1:
Multiple laser light source assemblies are arranged in an optimized spatial configuration along the base, utilizing the length and width dimensions efficiently. The intervals between assemblies are optimized to provide adequate space for heat dissipation and optical path separation while minimizing the overall footprint. This dimensional optimization allows multiple laser sources to be integrated without proportionally increasing the device volume, thereby improving laser output capability while controlling device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, reduces the size of the laser packaging device, and enhances heat dissipation by staggering laser chips and reflectors, thereby extending the service life of the laser chips and improving the device's miniaturization and efficiency.
Implementation Method 1
The laser light source assembly is configured to emit a laser. The light window covers the top surface to seal the accommodating cavity, and the laser is emitted through the light window.
Implementation Method 2
The laser light source assembly includes a laser chip and a reflector. The laser chip is electrically connected to the first end of the lead wire. The laser chip includes two light emission sources. Each of the emission sources is configured to emit the laser. The laser is reflected to the light window through the reflector.
Data Source
AI summary
A laser packaging device (1), comprising a base (10), a laser light source component (30), a lead wire (50), and a light window (60). The base (10) comprises a light source mounting portion (11) and a support portion (13); the light source mounting portion (11) and the support portion (13) are integrally arranged, and the light source mounting portion cooperates with the support portion (13) to form an accommodating cavity (15); the support portion (13) comprises a top surface (132) and a bottom surface (134); the laser light source component (30) is accommodated in the accommodating cavity (15) and is provided at the light source mounting portion (11); the laser light source component (30) is configured to emit laser; the lead wire (50) passes through the support portion (13); the lead wire (50) comprises a first end (52) and a second end (54) opposite to each other; the first end (52) is provided in the accommodating cavity (15) and is configured to be electrically connected with the laser light source component (30); the second end (54) is provided on the bottom surface (134); the light window (60) covers the top surface (132) to seal the accommodating cavity (15); and the laser is emitted through the light window (60). The light source mounting portion (11) and the support portion (13) are integrally arranged, thereby simplifying the manufacturing process of the base (10). In addition, the first end (52) of the lead wire (50) is provided in the accommodating cavity (15), and the second end (54) is provided on the bottom surface (134) of the support portion (13), thereby facilitating a decrease in the size of the base (10) and achievement of miniaturization of the laser packing device (1).