Surface-Emitting Laser Package With Integrated Diffusion Wiring
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Solution Overview
Problem
Current surface emitting laser packages face issues with electrical disconnection, moisture ingress, heat dissipation, and size reduction, while also requiring complex wire bonding and separate diffusion part attachment, which can lead to reliability concerns and increased manufacturing complexity.
Innovation Solution
A surface emitting laser package design featuring a housing with a step and diffusion part, conductive lines, and connection pads and lines with varying widths to minimize obstruction and facilitate easy detection of detachment, along with adhesive parts for enhanced fixability and moisture protection, eliminating the need for separate wire bonding and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then electrical connection is achieved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines the electrical connection function and optical diffusion function into a single integrated component. The conductive line serves dual purposes: providing electrical connection between the laser element and substrate, and acting as a diffusion part for optical beam shaping. This eliminates the need for separate wire bonding and diffusion part attachment, reducing device complexity while maintaining connection reliability.
Solution Approach 2:
The conductive line is designed to perform multiple functions simultaneously: electrical conduction, mechanical support, and optical diffusion. By making the conductive line wider and integrating it with the housing structure, it serves as both an electrical connector and a beam diffusion element, reducing the total number of components needed in the package.
2Illumination intensity
If separate diffusion part attachment is used, then optical beam diffusion is achieved, but manufacturing complexity and risk of detachment increase
Solution Approach 1:
The diffusion function is merged into the housing structure itself. The housing includes a step that forms part of the diffusion path, and the conductive line is positioned to work with the housing geometry to achieve beam diffusion. This eliminates the need for a separate attachable diffusion part, simplifying manufacturing and reducing detachment risks.
3Reliability
If conventional package structure is used, then laser element is protected, but product size is larger
Solution Approach 1:
The patent employs a nested structure where the laser element is positioned within a cavity of the housing, and the conductive line and diffusion part are integrated into the same spatial envelope. The housing step creates a compact arrangement where multiple functional elements are nested within each other's spatial footprint, reducing the overall package volume while maintaining protective enclosure.
4Reliability
If complex wire bonding process is used, then electrical connection is established, but productivity decreases
Solution Approach 1:
The electrical connection structure is designed to be formed as an integral part of the package assembly process. The conductive line is positioned and connected during the same manufacturing steps as the housing assembly, eliminating the need for separate wire bonding operations. This integration maintains connection reliability while significantly improving manufacturing productivity.
Data Source
AI summary
In a surface emitting laser package, a surface emitting laser element and a substrate may be electrically connected through a diffusion part. In detail, according to the surface emitting laser package, a housing includes a step, the diffusion part is disposed at the step of the housing, and the surface emitting laser element and the substrate may be electrically connected through a connection wiring extending through the housing to correspond to the step and a conductive line disposed at one side of the diffusion part.