Molded Laser Package EMI Shielding Using Plated Trenches
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Solution Overview
Problem
Existing methods for forming electromagnetic interference (EMI) shielding layers over semiconductor packages are costly and add significant complexity to the manufacturing process.
Innovation Solution
The development of a molded laser semiconductor package (MLP) with an integrated EMI shielding layer, where the shielding layer is formed over the package using a conductive material plated into trenches surrounding the units, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional methods are used to form EMI shielding layers over semiconductor packages, then effective EMI protection is achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent combines the EMI shielding layer formation with the existing package molding process by integrating shield formation into the molding cavity preparation. The shielding material is placed in the mold cavity before injecting the molding compound, allowing the shield to be formed simultaneously with the package encapsulation rather than as a separate post-processing step.
Solution Approach 2:
The molding cavity serves multiple functions: it shapes the package encapsulation and simultaneously forms the EMI shielding layer. The mold insert acts as both a structural component for package formation and as the EMI shield itself, eliminating the need for separate shielding components and assembly steps.
2Reliability
If additional shielding layers are added to semiconductor packages, then EMI protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the EMI shielding function with the package molding process by forming the shield as an integral part of the molding cavity. This integration eliminates multiple discrete process steps including separate shield application, alignment, and attachment operations that would otherwise be required.
Solution Approach 2:
The EMI shielding structure is prepared in advance as part of the molding cavity design and is already in place before the package molding begins. The shielding material is positioned and secured in the mold insert prior to injecting the molding compound, so no additional shielding steps are needed during or after package assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively shields semiconductor devices from EMI while reducing manufacturing costs and complexity, making it a more efficient method for producing EMI-protected semiconductor packages.
Implementation Method 1
an electromagnetic interference (EMI) shielding layer formed over the MLP units by plating conductive material over the top of the units and into trenches formed in saw streets surrounding the MLP units
Data Source
AI summary
A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.