Semiconductor Laser Package Layout for Optical Member Fault Shutdown
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Solution Overview
Problem
Existing light-emitting devices do not effectively stop light emission from semiconductor laser elements based on the state of the optical member, and they often require a large number of parts for abnormality detection.
Innovation Solution
A light-emitting device configuration that includes a semiconductor laser element, an optical member with a conductive portion, and a mounting member with insulated conductive regions, allowing the semiconductor laser element to be electrically connected to the mounting member via the conductive portion, enabling light emission to be stopped based on the optical member's state and reducing the number of parts needed for abnormality detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional abnormality detection configuration is used, then abnormality detection is achieved, but the number of parts increases
Solution Approach 1:
The patent combines the abnormality detection function with the existing optical member by forming a conductive portion directly on it. This integration eliminates the need for separate detection components, thereby reducing the total number of parts while maintaining reliable abnormality detection capability through monitoring electrical connection changes.
Solution Approach 2:
The optical member is given dual functionality: it performs its primary optical function while simultaneously serving as an abnormality detection element through its conductive portion. This multi-functionality reduces the need for dedicated detection components, addressing the contradiction between detection capability and part count.
2Reliability
If the optical member is detached or damaged, then abnormality occurs, but light emission cannot be stopped without additional components
Solution Approach 1:
The patent implements a feedback mechanism where the electrical connection state of the conductive portion on the optical member is monitored. When detachment or damage occurs, the change in electrical connection is detected, triggering control to stop light emission from the semiconductor laser element, thereby achieving reliable light emission control without adding complex mechanical stop mechanisms.
Solution Approach 2:
The patent replaces potential mechanical light stopping mechanisms with an electrical control system. By monitoring electrical connection changes in the conductive portion and using this information to control laser emission electrically, the system achieves light emission stopping functionality without mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration allows for effective stopping of light emission from the semiconductor laser element based on the optical member's state, while reducing the number of parts required for abnormality detection, thereby enhancing the device's efficiency and compactness.
Implementation Method 1
The optical member includes a conductive portion. The semiconductor laser element is electrically connected to the second conductive region via the conductive portion
Data Source
AI summary
A light-emitting device includes a semiconductor laser element, an optical member, and a mounting member. The semiconductor laser element has a light-emitting surface. The optical member has a light incident surface and includes a conductive portion. The mounting member has a mounting surface on which first and second conductive regions, and an insulating region are provided. The second conductive region is insulated from the first conductive region via the insulating region. The semiconductor laser element is disposed in the first conductive region of the mounting surface. The optical member is disposed on the mounting surface such that the conductive portion and the mounting surface face each other and the conductive portion overlaps at least portions of the first and second conductive regions in a plan view. The semiconductor laser element is electrically connected to the second conductive region via the conductive portion.