Laser Light Package Structure for Heat Dissipation and Integrity
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Solution Overview
Problem
Existing light emitting element packages, such as those using ceramic materials, face challenges with heat dissipation due to inefficient thermal management.
Innovation Solution
A light emitting device design incorporating a base member with a metal bottom part and ceramic frame, featuring a gap between the frame and bottom part to enhance heat dissipation, along with a reflective structure to direct light emission, and a substrate with integrated heat dissipation elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a light emitting element is disposed on a ceramic package body, then structural integrity is maintained, but heat dissipation performance is insufficient
Solution Approach 1:
The package body is segmented into a ceramic frame and a metal bottom part, with each material selected for its specific function: ceramic for structural integrity and electrical insulation, metal for heat dissipation. This segmentation allows simultaneous optimization of both structural integrity and thermal management properties.
Solution Approach 2:
The package body uses a composite structure combining ceramic and metal materials. The ceramic frame provides mechanical strength and insulation, while the metal bottom part provides thermal conduction. This composite approach resolves the contradiction between structural integrity and heat dissipation by leveraging the complementary properties of different materials.
2Temperature
If a gap is formed between the frame and bottom part, then heat dissipation is enhanced, but device complexity increases
Solution Approach 1:
The gap between the frame and bottom part is created as a deliberate segmentation feature, allowing independent optimization of thermal pathways. The gap enables heat to dissipate through multiple paths (through the metal bottom part and through the gap region), enhancing heat dissipation without requiring complex active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides improved heat dissipation performance, ensuring effective thermal management and reduced package size while maintaining structural integrity and optical efficiency.
Implementation Method 1
a light emitting device design incorporating a base member with a metal bottom part and ceramic frame, featuring a gap between the frame and bottom part to enhance heat dissipation
Implementation Method 2
along with a reflective structure to direct light emission
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
A light emitting device (1) comprises a semiconductor laser element (170), a light reflecting member (150) and a base member (110). The base member (110) includes a bottom part (118) having an arrangement surface on which the semiconductor laser element (170) and the light reflecting member (150) are arranged, and a frame part (111) bonded to the bottom part (118) and forming a frame surrounding the semiconductor laser element (170) and the light reflecting member (150). The frame part (111) has a bonding surface (113) bonded to the bottom part (118), a first inner surface (115) forming a frame of which the bottom part (118) is located inward, a second inner surface (116) forming a frame which is covered with the bottom part (118), and a planar surface intersecting the second inner surface (116). The planar surface and the second inner surface (116) form a step portion on an inner side of the frame of the frame part (111). First and second electrode layers (112, 114) are each electrically connected to the semiconductor laser element (170). The second electrode layer (114) is disposed on the planar surface of the frame part (111). The step portion is disposed along the entire periphery of the frame part (111) in a bottom view and not disposed along the entire periphery of the frame part (111) in a top view. The side along which the step portion is not formed is located at a side opposite to the semiconductor laser element (170) with the light reflecting member (150) disposed therebetween.