Laser Diode Bar Package With Jet-Impingement Dual-Side Cooling
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Solution Overview
Problem
High-power laser systems face thermal management issues, mechanical stability concerns, and corrosion problems due to increased operating temperatures and cooling fluid usage, which existing packaging solutions do not fully address.
Innovation Solution
A multi-component packaging system for laser diode bars featuring a two-piece anode cooler with a bottom and top cooler, utilizing materials like copper, tungsten, and alumina to optimize liquid cooling, resist corrosion, and enhance mechanical strength, while a cathode cooler can be optionally used to further improve thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If laser diodes are driven at increasingly higher currents to achieve higher laser powers, then power output is improved, but operating temperature increases causing thermal-management issues and reliability problems
Solution Approach 1:
The cooler is divided into two separate pieces: a first cooler in thermal contact with the anode and a second cooler in thermal contact with the cathode. This segmentation allows independent optimization of each cooler's thermal management, enabling more effective heat dissipation from both heat-generating surfaces of the laser diode, thereby supporting higher power output without excessive temperature increase.
Solution Approach 2:
The patent transitions from single-sided cooling to dual-sided cooling by adding thermal management in the dimension of the cathode side. This dimensional expansion of the cooling architecture allows heat to be extracted from both the anode and cathode surfaces simultaneously, effectively doubling the heat dissipation capacity and enabling higher operating currents.
2Temperature
If highly thermally conductive mounts with enclosed cooling passages are used, then thermal management is improved, but mechanical stability and corrosion resistance are compromised
Solution Approach 1:
Dividing the cooling system into two separate coolers allows each component to be optimized for its specific function. The first cooler can be designed specifically for anode thermal management with appropriate material selection for corrosion resistance, while the second cooler handles cathode cooling independently. This segmentation eliminates the need for complex enclosed passages that compromise mechanical stability.
Solution Approach 2:
The patent employs different materials for the two coolers based on their specific requirements. The first cooler (anode side) may use highly thermally conductive materials like copper or aluminum, while the second cooler (cathode side) can use corrosion-resistant materials. This composite material approach allows optimization of thermal performance without sacrificing mechanical stability or corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers junction temperatures, enhances mechanical stability, and allows for higher power output at higher current levels, improving the reliability and efficiency of high-power laser systems.
Implementation Method 1
The bottom anode cooler defines at least partially therethrough a plurality of ports for forming jets of cooling fluid through the ports. The top anode cooler defines a recess therein that has an impingement surface facing the ports of the bottom anode cooler, whereby cooling fluid introduced into the bottom anode cooler and jetted through the ports strikes the impingement surface of the top anode cooler to cool a laser emitter
Implementation Method 2
In various embodiments, the top and/or bottom anode coolers include, consist essentially of, or consist of one or more materials such as copper, aluminum, stainless steel, CuW, tungsten, WC (tungsten carbide), alumina, mullite, diamond, and/or SiC
Implementation Method 3
In various embodiments, the top and/or bottom anode coolers include, consist essentially of, or consist of one or more materials such as copper, aluminum, stainless steel, CuW, tungsten, WC (tungsten carbide), alumina, mullite, diamond, and/or SiC
Data Source
AI summary
In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.