Laser Package Offset Marking for Precise Passive Alignment
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Solution Overview
Problem
Current laser packages face challenges in achieving high-precision alignment due to component tolerances and manufacturing tolerances, leading to time-consuming, costly, and imprecise active alignment processes, while passive alignment methods often fall short in achieving sufficient precision.
Innovation Solution
Incorporating a position marker on the outer surface of the laser package housing, which is generated by exposing a photosensitive area with a laser beam after assembly, allowing for high-precision passive alignment by indicating the laser light offset relative to a reference on the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If active alignment is used to achieve high-precision alignment of the laser package, then alignment precision is improved, but alignment time and cost increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-generating position markers on the housing during the manufacturing process, before the actual alignment operation. These markers are created using a photosensitive material that is exposed to light during assembly, establishing reference points in advance that eliminate the need for time-consuming active alignment procedures later.
Solution Approach 2:
The patent uses copying by creating optical copies or representations of the laser beam position through position markers on the housing. Instead of directly measuring and adjusting the laser beam during active alignment, the system creates marker patterns that replicate the beam's intended position, allowing passive alignment through visual or optical reference to these markers.
2Measurement precision
If active alignment with snap-curing or UV-curing process is used, then alignment precision is improved, but process complexity and interconnect options are limited
Solution Approach 1:
The patent replaces the mechanical and chemical systems of active alignment with an optical marking system. Instead of using snap-curing or UV-curing processes that require specific mechanical fixtures and chemical adhesives, the system uses optical exposure of photosensitive materials to create position markers, substituting a simpler optical process for complex mechanical-chemical alignment procedures.
3Productivity
If passive alignment is used to reduce cost and time, then alignment cost and time are reduced, but alignment precision deteriorates due to accumulated tolerances
Solution Approach 1:
The patent introduces position markers as an intermediary element between the housing and the alignment process. These markers serve as mediator references that allow passive alignment to achieve precision previously only attainable through active alignment. The markers translate the complex tolerance accumulation problem into a simple visual or optical reference system.
Solution Approach 2:
The patent utilizes color changes or optical property changes in photosensitive materials to create visible position markers. The photosensitive material changes its optical characteristics (such as becoming opaque, changing color, or creating a physical relief) when exposed to light, providing clear visual references for passive alignment that overcome the precision limitations of traditional passive methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise passive alignment of the laser package, reducing technical effort and costs associated with active alignment, while maintaining high precision by accounting for component and manufacturing tolerances through the position marker.
Implementation Method 1
exposing a photosensitive area with a laser beam after assembly, allowing for high-precision passive alignment by indicating the laser light offset
Data Source
AI summary
The invention relates to a method for determining a laser light offset in a laser package having a carrier substrate, at least one laser device arranged on the carrier substrate for emitting laser light surrounded by a housing cover, the housing cover having a light exit window through which a laser beam is emitted from the laser package during the intended use of the laser package. The method comprises the following steps: providing the laser package with at least one photosensitive area on a surface of the housing cover and/or carrier substrate; energizing the at least one laser device so that it emits a laser beam; and deflecting the emitted laser beam in the direction of the at least one photosensitive area to generate a position marker on the at least one photosensitive area; wherein the position marker indicates the position and/or direction of the center axis of the laser beam relative to a target position and/or target direction, and wherein the position marker and/or target position and/or target direction is relative to at least one reference on the housing cover and/or the carrier substrate.