Laser Package Structure for Post-Sealing Optical Alignment
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Solution Overview
Problem
Existing laser devices face challenges in maintaining accurate mounting of reflective components, leading to deviations in laser beam paths and difficulty in adjusting positions post-encapsulation, which affects the luminous effect and increases encapsulation complexity.
Innovation Solution
A laser device design that includes a substrate, frame, packaging structure, light-emitting chip, wavelength conversion component, and cover, allowing for active adjustment of components post-encapsulation, with lower airtightness requirements and simplified encapsulation processes, ensuring precise alignment and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflective components are mounted and encapsulated in traditional laser devices, then the device structure is sealed and protected, but the mounting accuracy decreases and adjustment becomes difficult
Solution Approach 1:
The patent introduces adjustable mechanisms that allow reflective components to be positioned and adjusted after encapsulation. The adjustable reflective component includes a mounting structure with adjustment mechanisms enabling post-encapsulation positioning, transforming the static sealed structure into a dynamically adjustable one that maintains both sealing and precision.
Solution Approach 2:
The device is divided into separate encapsulation regions: a first encapsulation structure seals the light-emitting chip, while a second encapsulation structure seals the adjustable reflective component. This segmentation allows independent adjustment of the reflective component without compromising the sealing of the light-emitting chip region.
2Manufacturing precision
If components are adjusted post-encapsulation, then mounting precision can be improved, but the encapsulation complexity increases
Solution Approach 1:
The patent divides the encapsulation into multiple independent structures: a first encapsulation structure for the light-emitting chip and a second encapsulation structure for the reflective component. This segmentation simplifies each individual encapsulation process while enabling post-encapsulation adjustment of the reflective component without complicating the overall sealing system.
Solution Approach 2:
The patent introduces adjustment mechanisms as intermediary structures between the reflective component and the encapsulation housing. These mechanisms include adjustment screws, springs, or magnetic components that mediate the positioning process, allowing precise adjustment without requiring complex re-encapsulation procedures.
3Reliability
If traditional encapsulation is used, then the device is sealed, but adjustment of laser beam path becomes difficult
Solution Approach 1:
The patent transforms the static sealed encapsulation into a dynamic system where the reflective component can be adjusted after sealing. The adjustable reflective component includes mounting structures with adjustment mechanisms that enable beam path modification while maintaining the sealed environment, resolving the contradiction between sealing and adjustability.
Solution Approach 2:
The patent incorporates adjustment mechanisms during the encapsulation process itself, allowing the reflective component to be pre-positioned and adjusted before final sealing. This preliminary adjustment action ensures both sealing integrity and future adjustability without requiring post-encapsulation disassembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables accurate alignment of components, enhances the luminous effect, reduces encapsulation complexity, and improves the working reliability of the laser device by allowing for adjustments post-encapsulation, while maintaining airtightness and protecting components from environmental damage.
Implementation Method 1
Any one of the at least one light-emitting chip is located in the second accommodation space and configured to emit laser beams
Implementation Method 2
the target optical element is configured to exit the received laser beams out of the first accommodating space
Data Source
AI summary
A laser device includes a substrate, a first frame, at least one packaging structure, at least one light-emitting chip, a target optical element and a first cover. The first frame is fixed to the substrate to define a first accommodating space. The packaging structure is located in the first accommodating space and forms a second accommodating space. The light-emitting chip is located in the second accommodating space and configured to emit laser beams. The target optical element is located in the first accommodating space. The first cover is fixed to a side of the first frame away from the substrate. The packaging structure includes a target side wall, located on a light exit side of the light-emitting chip and the target side wall is light-transmissive. The laser beams emitted from the light-emitting chip is transmitted to the target optical element through the target side wall.