Surface-Emitting Laser Package With Integrated Reflection Feedback
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Solution Overview
Problem
Semiconductor light emitting devices face challenges in maintaining constant laser light output despite temperature variations, as existing technologies lack effective methods to efficiently control the current supplied to surface emitting laser chips based on real-time light intensity feedback.
Innovation Solution
The semiconductor light emitting device incorporates a surface emitting laser chip, a light receiving chip, and a reflecting portion within the sealing member, where the light receiving chip receives reflected laser light to adjust the current supplied to the surface emitting laser chip, ensuring consistent output through auto power control driving, while the reflecting portion, with irregularities on the sealing surface, enhances light reception and maintains directivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate reflecting member is used to reflect laser light toward the light receiving chip, then light reception efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The reflecting portion is integrated directly into the sealing member structure, combining two functions (sealing and light reflection) into a single component. This eliminates the need for a separate reflecting member while maintaining light reflection efficiency, thereby reducing device complexity and manufacturing difficulty
Solution Approach 2:
The sealing member is designed to serve multiple functions: it provides environmental sealing for the laser chip and light receiving chip, and simultaneously acts as a light reflecting structure through its integrated reflecting portion. This multi-functionality reduces the total number of components needed in the device
2Measurement precision
If the light receiving chip is positioned closer to the surface emitting laser chip, then light reception efficiency improves, but directivity control becomes more difficult
Solution Approach 1:
The reflecting portion serves as an intermediary optical element that redirects laser light at controlled angles toward the light receiving chip. This allows the light receiving chip to be positioned closer to the laser chip while maintaining proper light directionality through the reflecting surface, solving both the efficiency and control problems
Solution Approach 2:
Instead of directly positioning the light receiving chip in line with the laser emission, the reflecting portion introduces a spatial dimension change by reflecting light at specific angles. This allows optimized positioning in three-dimensional space, achieving both close proximity for efficiency and controlled directivity
3Stability of the object's composition
If auto power control driving is implemented to maintain constant laser output, then temperature stability improves, but current control complexity increases
Solution Approach 1:
The light receiving chip detects the actual light output from the surface emitting laser chip and provides feedback signals. Based on this feedback, the driving circuit adjusts the current supplied to the laser chip in real-time, maintaining constant light output despite temperature variations. This feedback mechanism enables automatic temperature compensation without requiring complex external control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for precise control of laser light output, reducing temperature-related fluctuations and improving manufacturing efficiency by integrating the reflecting portion with the sealing member, thus maintaining consistent light emission and simplifying the manufacturing process.
Implementation Method 1
a reflecting portion (70) that reflects a part of the laser light toward the light receiving chip (40)
Implementation Method 2
the light receiving chip (40) receives reflected laser light to adjust the current supplied to the surface emitting laser chip
Data Source
AI summary
A semiconductor light emitting device includes a surface emitting laser chip, a light receiving chip, a sealing member, and a reflecting portion. The surface emitting laser chip has a light emitting surface and emits laser light from the light emitting surface. The sealing member is formed of a material through which the laser light can pass and seals the surface emitting laser chip and the light receiving chip. The reflecting portion is provided in the sealing member and reflects a part of the laser light toward the light receiving chip. The light receiving chip is arranged at a position where the light receiving chip receives at least a part of reflected light by the reflecting portion.