Laser Diode Package With Reflective Surface for SMT Pulse Emission
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Solution Overview
Problem
Conventional semiconductor laser diode packages, such as TO packages, have high parasitic inductance, low mounting efficiency, and difficulties with surface-mounted technology (SMT) due to their design, limiting their ability to generate narrow pulses and efficiently emit light in applications requiring precise light directionality.
Innovation Solution
A laser diode package module with a substrate, cover, and reflective surface is designed, where the laser diode die is mounted on the substrate with the reflective surface directing the emitted light through a light-transmitting area on the cover, allowing for efficient substrate packaging and reduced parasitic inductance, enabling SMT and improved light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If TO packaging technology is used to ensure vertical light emission, then light directionality is improved, but parasitic inductance increases and mounting efficiency decreases
Solution Approach 1:
The package structure is divided into separate functional components: substrate for mounting, cover for enclosure, and reflective surface for light direction control. This segmentation allows optimization of each component independently, reducing overall parasitic inductance while maintaining light directionality through the reflective surface geometry.
Solution Approach 2:
A reflective surface is introduced as an intermediary element between the laser diode die and the external environment. This reflective surface redirects light at specific angles without requiring the laser diode itself to be oriented vertically, thereby reducing parasitic inductance in the electrical path while maintaining controlled light emission direction.
2Illumination intensity
If TO packaging technology is used to ensure vertical light emission, then light directionality is improved, but mounting efficiency decreases and SMT becomes difficult
Solution Approach 1:
The package design adopts a standardized substrate mounting interface that is compatible with surface-mounted technology (SMT) processes. The substrate serves multiple functions: mechanical support, electrical connection, and positioning for automated mounting. This universal mounting approach enables the laser package to be integrated using standard SMT equipment, significantly improving mounting efficiency and productivity.
3Device complexity
If conventional laser package design is used, then structural simplicity is maintained, but light emission angle control is limited
Solution Approach 1:
The reflective surface is designed with specific local geometric properties (angle, curvature, material) to control light emission at particular angles. By optimizing the local quality of the reflective surface at the light interaction point, precise angular control is achieved without significantly increasing overall structural complexity. The rest of the package maintains a simple, standardized structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces parasitic inductance, enhances packaging efficiency, and allows for the emission of laser pulses at specific angles, facilitating the use of semiconductor lasers in applications requiring precise light directionality and high-power emission.
Implementation Method 1
a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface
Data Source
AI summary
The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.