Semiconductor Laser Package With Integrated Sealing Window
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Solution Overview
Problem
The existing semiconductor light emitting devices have complex structures with many components and assembly processes, leading to increased costs and component costs, which hinders the expansion of high-power blue semiconductor lasers into industrial applications like laser processing.
Innovation Solution
A semiconductor light emitting device with a simplified configuration featuring a semiconductor light emitting element mounted on a first housing unit with a wiring structure, and a second housing unit with a lid shape, anti-reflection coating, and a rough surface for light transmission, bonded to the first housing unit, using ceramic substrates and metal patterns for airtight sealing and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex structure with many components and assembly processes is used for airtight sealing, then sealing reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple functions into the cover member: it serves as both the sealing structure and the light transmission window, eliminating the need for separate window components. The bonding member simultaneously provides mechanical bonding and environmental sealing, reducing the total component count while maintaining airtight sealing reliability.
Solution Approach 2:
The cover member is designed with multi-functionality, acting as both a protective seal and an optical window for light transmission. This universal component approach reduces device complexity by eliminating dedicated separate components for each function, while the anti-reflection coating ensures optical performance is not compromised.
2Reliability
If multiple housing members and bonding members are used for airtight sealing, then sealing reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the window function into the cover member itself, eliminating the need for separate window components and their associated bonding processes. This reduction in component count directly lowers manufacturing cost while the bonding member ensures reliable airtight sealing between the reduced number of housing members.
3Ease of manufacture
If a simplified configuration with fewer components is used, then manufacturing cost is reduced, but airtight sealing may be compromised
Solution Approach 1:
By combining the sealing and light transmission functions into the cover member, the patent achieves simplification without compromising sealing reliability. The bonding member is designed to provide robust airtight sealing between the simplified housing structure, ensuring that fewer components do not mean poorer sealing performance.
Solution Approach 2:
The patent applies anti-reflection coating to the cover member's light transmission surface, changing the optical parameters to maintain high light transmission efficiency. This parameter change ensures that the simplified single-cover structure achieves both cost reduction and maintained optical performance alongside reliable sealing.
4Reliability
If complex assembly processes are used for mounting window and lid, then sealing reliability is improved, but assembly time and cost increase
Solution Approach 1:
The patent combines the window and lid into a single cover member, reducing the number of assembly steps. Instead of separately mounting a window and then a lid, the integrated cover member is mounted in one operation, significantly improving assembly efficiency while the bonding member ensures reliable sealing is achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the number of components and assembly costs, enabling airtight sealing and expanding the usage of high-power blue semiconductor lasers in industrial fields by simplifying the device configuration and improving heat dissipation and reliability.
Implementation Method 1
the second housing unit may be provided with anti-reflection coating with respect to emitted light on one surface or both surfaces of the light emission surface
Implementation Method 2
a rough surface configured to be able to transmit light
Implementation Method 3
The housing member and the cover are bonded via a bonding member, whereby the light emitting element is airtightly sealed
Data Source
AI summary
A configuration includes a semiconductor light emitting element (40) including at least one light emitting region, a first housing unit (10) on which the semiconductor light emitting element (40) is mounted, the first housing unit (10) including a wiring structure with which the semiconductor light emitting element (40) can be externally connected, and a second housing unit (30) having a lid shape, the second housing unit (30) including a light emission surface (32b) and a rough surface (31a) configured to be able to transmit light, the second housing unit (30) being bonded to the first housing unit (10).