Semiconductor Laser Package With Stepped Reflector Mount
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Solution Overview
Problem
Conventional light emitting devices with integrated light reflecting members face challenges in size reduction and productivity due to the increased size and complex shape of these members, which hinder their industrial applicability and cost-effectiveness.
Innovation Solution
The design incorporates a semiconductor laser element with a base portion featuring a frame with a step, where a flat plate-shaped light reflecting member is leaned against the step, allowing for compactness and simplified manufacturing, using a bonding agent for stabilization and adjustable leaning angles, and employing materials like glass or metal for high reflectivity and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light reflecting member is disposed inside the package to extract light from the semiconductor laser element, then the light extraction efficiency is improved, but the size of the light emitting device is increased
Solution Approach 1:
The light reflecting member is integrated with the base portion to form a single unified structure. The base portion includes a bottom portion and a frame portion with an inner surface that forms the light reflecting surface, eliminating the need for a separate light reflecting member and reducing overall device size while maintaining light extraction efficiency
Solution Approach 2:
The base portion serves multiple functions: it provides mechanical support for the semiconductor laser element, acts as a heat dissipation structure, and functions as a light reflecting member through its frame portion with high reflectivity coating. This multi-functionality reduces the number of separate components needed in the device
2Illumination intensity
If a light reflecting member with complicated shape is used to optimize light extraction, then the light extraction efficiency is improved, but the manufacturing complexity and productivity are negatively affected
Solution Approach 1:
The base portion is divided into a bottom portion and a frame portion, where the frame portion specifically provides the light reflecting function. This segmentation allows the light reflecting surface to be formed as a simple structural element rather than a complex shaped component, easing manufacturing while maintaining optical performance
Solution Approach 2:
The inner surface of the frame portion is coated with a high reflectivity material to change the optical parameters of the surface. This allows a simple geometric shape to achieve complex light extraction functionality through material property modification rather than shape complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves size and weight reduction, enhances productivity, and lowers production costs by using a simpler, flat plate-shaped light reflecting member, improving the overall efficiency and industrial availability of light emitting devices.
Implementation Method 1
The light reflecting member is provided to reflect light from the semiconductor laser element
Data Source
AI summary
A light emitting device includes: a first semiconductor laser element; a base portion including: a bottom portion including a first upper surface on which the first semiconductor laser element is disposed, and a frame portion surrounding the first semiconductor laser element, the frame portion including a second upper surface positioned above the first upper surface and a support portion positioned between the first upper surface and the second upper surface, the a support portion having a support area; a light reflecting member having a flat plate-shaped and contacting the support area, the light reflecting member being configured to reflect light from the first semiconductor laser element; and a lid portion bonded to the second upper surface.