Semiconductor Laser Package Thermal Gradient for Stress Control
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Solution Overview
Problem
Existing semiconductor lasers face issues with thermal conductivity uniformity, thermal stress distribution, and efficiency decay due to high current densities, leading to problems such as red shift, power drop, and premature aging.
Innovation Solution
Designing a semiconductor laser package and module with specific thermal conductance, thermal resistance, and material gradients to enhance uniform thermal conductivity and stress distribution, using materials like Cu, SiC, and AuSn to improve heat dissipation and electro-static discharge resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current density is used to achieve high power output, then laser power increases, but thermal conductivity uniformity deteriorates and thermal stress distribution becomes non-uniform
Solution Approach 1:
The patent applies local quality by creating a thermal conductance gradient where different regions of the package have different thermal conductance values. The thermal conductance of the tube holder (a), tube tongue (b), and heat sink (c) are specifically designed to form a gradient (d≤a≤b≤c or d≤a≤c≤b), ensuring that heat is distributed more uniformly throughout the structure despite high current density operation.
2Power
If high current density is used to achieve high power output, then laser power increases, but thermal stress distribution uniformity deteriorates
Solution Approach 1:
The patent addresses thermal stress distribution by designing a thermal conductance gradient across different package components. By ensuring that thermal conductance increases from the laser chip through the tube tongue to the heat sink (a≤d≤b≤c or a≤d≤c≤b), the patent creates more uniform thermal stress distribution that prevents device failure under high power operation.
3Device complexity
If conventional packaging is used, then device simplicity is maintained, but heat dissipation performance is insufficient leading to efficiency decay
Solution Approach 1:
The patent applies parameter changes by modifying the thermal conductance values of different package components. Specifically, the thermal conductance of the tube holder (a), tube tongue (b), and heat sink (c) are optimized to form a gradient, and the laser chip thermal conductance (d) is matched to this gradient. This parameter optimization enables efficient heat dissipation while maintaining a relatively simple package structure.
4Loss of energy
If thermal conductance is increased to improve heat dissipation, then heat dissipation performance improves, but thermal stress uniformity may deteriorate without proper gradient design
Solution Approach 1:
The patent resolves this contradiction by implementing a thermal conductance gradient where different components have specifically designed thermal conductance values. The tube holder (a), tube tongue (b), and heat sink (c) are designed with increasing thermal conductance from the laser chip outward (d≤a≤b≤c or d≤a≤c≤b), ensuring both efficient heat dissipation and uniform thermal stress distribution.
Solution Approach 2:
The patent optimizes thermal stress distribution by carefully selecting and matching thermal conductance parameters across different package components. The thermal conductance of the laser chip (d) is matched to the tube holder (a), which is then matched to the tube tongue (b) and heat sink (c), creating a coordinated gradient that simultaneously improves heat dissipation and maintains thermal stress uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in improved heat dissipation, reduced thermal stress, and extended lifespan by minimizing thermal lensing and stress birefringence effects, enhancing beam quality and electro-static discharge resistance.
Implementation Method 1
a thermal conductance of the tube holder may be a, a thermal conductance of the tube tongue may be b, a thermal conductance of the heat sink may be c, and a thermal conductance of the laser may be d
Data Source
AI summary
The present disclosure provides a semiconductor laser package and module. The package and module include a pin, a tube holder, a tube tongue, a heat sink, and a laser. A packaging form includes at least one of a plastic-encapsulated package and module, a transistor outline can (TO-CAN)-type package and module, and a chip-on-submount (COS) package and module. The package and module have a thermal conductance gradient. A thermal conductance of the tube holder is a, a thermal conductance of the tube tongue is b, a thermal conductance of the heat sink is c, and a thermal conductance of the laser is d, wherein the thermal conductance gradient is one of d≤a≤b≤c, d≤a≤c≤b, a≤d≤b≤c, or a≤d≤c≤b.