Miniaturized Laser Package With Telescopic VBG Alignment
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Solution Overview
Problem
Conventional laser packaging designs for micro-chip oscillators are inadequate for achieving thermally independent, single-mode operation due to thermal stresses and multi-mode interference, which is critical for applications like tactical laser transmitters and space sensors.
Innovation Solution
A miniaturized laser package incorporating a collimated fiber optic input assembly, a micro-chip laser cavity, and a volume Bragg grating with a telescopic configuration and thermally compatible materials like fused silica to manage heat and reduce unwanted modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional laser packaging designs are used, then the device structure is simple, but thermal stresses cause multi-mode interference and prevent thermally independent operation
Solution Approach 1:
The packaging structure is divided into separate thermal management zones with independent heat sinking paths for the pump diode and micro-chip oscillator. This segmentation allows each component to be thermally managed independently, preventing thermal stresses that cause multi-mode interference while maintaining operational reliability.
Solution Approach 2:
Thermal isolation materials and intermediate thermal management structures are introduced between the pump diode and micro-chip oscillator. These intermediaries prevent heat transfer from the pump diode to the micro-chip, eliminating thermal stresses that would otherwise cause multi-mode interference and ensure stable single-mode operation.
2Volume of moving object
If the laser cavity is miniaturized, then the device size is reduced, but thermal management becomes more challenging
Solution Approach 1:
The miniaturized packaging employs a nested structure where the micro-chip oscillator is housed within a compact cavity that is itself integrated into the larger package assembly. Multiple functional components are nested within each other, achieving significant size reduction while maintaining adequate thermal management through the nested thermal pathways.
Solution Approach 2:
The packaging structure implements localized thermal management with different thermal conductivity materials positioned strategically throughout the compact device. High thermal conductivity materials are placed at critical heat generation points, while thermal isolation materials are positioned where heat transfer would be detrimental, enabling precise thermal control in the miniaturized format.
3Reliability
If thermal isolation structures are added, then thermally independent operation is achieved, but the device complexity increases
Solution Approach 1:
Multiple functions are merged into integrated packaging components. The thermal isolation structures are combined with mechanical mounting features and optical alignment references, eliminating the need for separate components. This merging achieves thermal independence while minimizing the increase in overall device complexity.
Solution Approach 2:
The packaging structures serve multiple functions simultaneously: providing mechanical support, enabling optical alignment, and managing thermal isolation. By designing components with multi-functionality, the patent achieves thermally independent operation without proportionally increasing device complexity, as each component performs several critical roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables thermally independent operation, reduces multi-mode interference, and allows for tunable single-mode light wavelength, ensuring reliable performance in applications requiring precise lasing.
Implementation Method 1
a volume Bragg grating with a telescopic configuration
Implementation Method 2
a collimated fiber optic input assembly
Data Source
Figure 1A~1B
Figure 2
Figure 3A
AI summary
A solid-state lasing device (100, 200, 300) includes a micro-chip oscillator (MCO)(102, 202, 302) affixed to a first tube (104, 204, 304), and a volume Bragg grating (VBG) plate (106, 206, 306) affixed to a second tube (108, 208, 308). The second tube is configured to be telescopically coupled to the first tube with a slip fit such that the VBG plate is concentrically aligned with and is positioned at a specified distance from the MCO.