Laser Packaging Pedestal Thermal Insulation for OLED Crack Prevention
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Solution Overview
Problem
The rapid cooling of glass powders during the laser packaging of OLED substrates on metal pedestals leads to increased crack probability and reduced durability, affecting the yield and longevity of the packaging process.
Innovation Solution
A pedestal with thermal-insulation structures, including bar-like grooves and air vents, is used to reduce heat dissipation and slow down the cooling rate of glass powders, preventing rapid temperature changes and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the OLED substrate is placed directly on the metal pedestal for laser packaging, then the packaging process can be completed efficiently, but the glass powders cool too quickly causing cracks and reducing yield
Solution Approach 1:
The patent introduces thermal insulation structures (made of materials like ceramic, glass fiber, or air layers) as intermediary elements between the metal pedestal and the glass powders. These structures mediate the thermal interaction by reducing heat conduction from the laser-heated glass powders to the metal pedestal, thereby slowing down the cooling rate and preventing thermal shock-induced cracks while maintaining the packaging process efficiency
Solution Approach 2:
The patent applies thermal insulation structures specifically at the contact regions between the substrate and the metal pedestal, particularly beneath the glass-powder areas. This localized application of thermal insulation properties allows the rest of the system to maintain its original characteristics while preventing rapid cooling only where needed, thus improving yield without compromising overall process efficiency
2Speed
If the glass powders are heated rapidly by laser, then the packaging process is fast, but the rapid temperature change causes cracks in glass substrate and powders
Solution Approach 1:
The thermal insulation structures serve as a thermal buffer or intermediary layer that decouples the rapid heating process from the cooling process. The laser can still heat the glass powders rapidly, but the insulation structure prevents this heat from being quickly conducted away to the metal pedestal, thereby maintaining the temperature gradient necessary for sintering while avoiding rapid cooling that would cause thermal shock and cracks
Solution Approach 2:
The patent changes the thermal parameters of the system by introducing materials with low thermal conductivity between the glass powders and metal pedestal. This parameter change in the thermal environment allows the glass powders to maintain higher temperatures for longer durations, reducing the temperature change rate (dT/dt) and preventing thermal shock while preserving the rapid heating capability of the laser
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of thermal-insulation structures on the pedestal effectively reduces the probability of cracks in glass powders and substrates, enhancing the packaging yield and product durability.
Implementation Method 1
scanning and heating are performed along a path of pre-sintered glass powders on the OLED substrate in sequence to complete the packaging
Implementation Method 2
thermal-insulation structures are provided at a side of the metal pedestal body supporting a substrate to be packaged
Data Source
AI summary
A laser packaging device and its pedestal are provided. The pedestal includes a metal pedestal body and thermal-insulation structures. The thermal-insulation structures are provided at a side of the metal pedestal body supporting a substrate to be packaged. The thermal-insulation structures correspond to glass-powder areas of sub-substrates within the substrate to be packaged in a one-to-one manner.