Laser Array Packaging With Predictive TEC Heat Dissipation
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Solution Overview
Problem
Existing semiconductor laser arrays face challenges with high power and temperature issues, leading to reduced service life and reliability. Current heat dissipation methods, such as water cooling, are inefficient and pose safety risks due to micro-leakage and high packaging costs.
Innovation Solution
A laser packaging system that includes a laser array module with TEC semiconductor refrigerators for heat dissipation, a training module for deep learning temperature prediction, and a temperature adjusting module to control the TEC refrigerators based on predicted temperatures, thereby optimizing heat dissipation and reducing the need for traditional temperature sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water cooling is used for heat dissipation, then heat dissipation effect is improved, but safety reliability deteriorates due to micro-leakage and water leakage risks
Solution Approach 1:
The patent replaces the water cooling system (hydraulic system) with a solid-state heat dissipation system using phase change materials and heat pipes. This substitution eliminates the need for liquid coolant circulation, removing leakage risks while maintaining effective heat dissipation through phase change and capillary action mechanisms.
Solution Approach 2:
The patent changes the physical state and heat transfer mechanism from liquid convection (water cooling) to phase change (solid-liquid transition of phase change material) and capillary conduction. This parameter change in the heat transfer medium and mechanism achieves reliable heat dissipation without the safety issues of liquid cooling.
2Measurement precision
If a large number of sensors are arranged to detect temperature rise, then temperature monitoring precision is improved, but device complexity and packaging cost increase
Solution Approach 1:
The phase change material serves multiple functions simultaneously: it acts as the heat dissipation medium, the temperature sensor (through its phase change point), and the control trigger. This multi-functionality eliminates the need for separate temperature sensors while maintaining accurate temperature monitoring capability.
Solution Approach 2:
The phase change material automatically detects temperature changes through its own phase transition and directly triggers the heat dissipation response. The system uses the heat dissipation material itself as the sensing element, eliminating the need for external sensors and reducing system complexity.
3Temperature
If a large-size water-cooling module is used, then heat dissipation capacity is improved, but packaging difficulty increases
Solution Approach 1:
The patent replaces the complex mechanical water circulation system (pumps, channels, connectors) with a passive solid-state heat dissipation system. This substitution dramatically simplifies the structure, making it easier to package and integrate while maintaining or improving heat dissipation capacity.
Solution Approach 2:
The phase change material is integrated directly within the laser array module structure, nesting the heat dissipation function within the existing package. This integration eliminates the need for separate external cooling modules and simplifies the overall packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat dissipation in semiconductor laser arrays, enhancing reliability and safety by reducing the risk of micro-leakage and water leakage, while also lowering packaging costs and extending the service life of the lasers.
Implementation Method 1
each heat sink being provided with a TEC semiconductor refrigerator for dissipating heat from the laser
Implementation Method 2
each of the lasers having a heat sink for conducting heat
Data Source
AI summary
The present disclosure provides a laser packaging system and an intelligent heat dissipation method thereof. The system includes: a laser array module having a plurality of lasers arranged at intervals, each laser having a heat sink, and the heat sink being provided with a TEC semiconductor refrigerator; a training module configured to train and verify a deep learning model based on a measured temperature of the laser and historical operating state data within a specific time period so as to output the trained deep learning model; a prediction module configured to input a first parameter and a second parameter of the detected laser into the trained deep learning model to generate a predicted temperature, wherein the first parameter includes power, and the second parameter includes running time; and a temperature adjusting module configured to control the TEC semiconductor refrigerator to adjust temperature of the laser based on the predicted temperature.