Laser Cutting Pallet With Liquid Shielding for Beam Leakage
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Solution Overview
Problem
Laser processing devices face the challenge of laser beam leakage due to reflection from the cutting table, leading to complex device structures and imperfect light shielding, especially in gantry-type devices where the entire table cannot be covered, and existing cooling methods do not address light shielding effectively.
Innovation Solution
A laser processing device that uses a transmission inhibition liquid stored in a container beneath the workpiece to absorb laser beams, preventing leakage by ensuring the liquid is present up to the height of the workpiece, thereby simplifying the device construction and maintaining effective light shielding without the need for additional shielding members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cutting table-side light shielding member is installed below the workpiece to prevent laser beam leakage, then light shielding effectiveness is improved, but device construction becomes complicated
Solution Approach 1:
The patent uses a water tank filled with water positioned below the workpiece to absorb and shield the laser beam. Instead of using solid light shielding members that complicate the device structure, the invention employs a fluid medium (water) that can be easily contained in a tank, simplifying the overall construction while maintaining effective light shielding.
Solution Approach 2:
The water in the water tank acts as an intermediary substance between the laser beam and the surrounding environment. The water absorbs the laser beam energy, preventing it from leaking outward, while the tank structure remains simple and does not add significant complexity to the device.
2Reliability
If a cutting table-side light shielding member is used to prevent laser beam leakage, then light shielding is improved, but the shielding member is scraped off by the laser beam over time, reducing shielding effectiveness
Solution Approach 1:
The patent employs water as a fluid shielding medium in a water tank, which does not suffer from the scraping and wear problems that affect solid light shielding members. The water can be easily replenished or replaced, ensuring long-term shielding effectiveness without the durability issues of solid materials exposed to high-intensity laser beams.
3Temperature
If water is used for cooling the workpiece or preventing dust scattering, then cooling effectiveness is improved, but light shielding of the laser beam is not addressed
Solution Approach 1:
The water in the water tank serves multiple functions simultaneously: it cools the workpiece from below, prevents dust scattering, and shields the laser beam from leaking outward. This multi-functional use of water eliminates the need for separate systems for each function, simplifying the overall device construction while addressing all three requirements effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents laser beam leakage with a simple device structure, reducing the complexity of light shielding and enhancing cooling efficiency by immersing the workpiece in the transmission inhibition liquid, which absorbs the laser beam and reduces scattering.
Implementation Method 1
a transmission inhibition liquid inhibiting transmission of laser beam is used to prevent leakage of the laser beam
Implementation Method 2
the water in the water tank cools the workpiece during laser cutting
Data Source
AI summary
A laser processing device is a device that processes a workpiece using a laser beam, and includes a cutting pallet and a container. The cutting pallet includes a placement unit that supports a lower surface of the workpiece. The container supports the cutting pallet and is capable of storing a transmission inhibition liquid inhibiting transmission of light having a wavelength greater than or equal to 0.7 µm and less than or equal to 10 µm up to a height position of the placement unit.