Laser Processing Parameter Detection via Interruption Speed
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Solution Overview
Problem
Current laser processing technologies face challenges in determining the influence of laser parameters on cutting and welding operations, leading to quality deterioration and machine downtime due to subjective evaluation methods and the need for expensive equipment and expertise.
Innovation Solution
Automated methods are introduced to determine the influence of laser processing parameters by conducting linear operations with varying parameters until an interruption occurs, using sensors to detect interruptions, and evaluating relationships between processing lengths, times, and speeds to identify optimal parameter values and diagnose issues such as focal shifts and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If subjective evaluation methods are used to adjust or check optical setpoint status, then operator experience can guide adjustments, but the process becomes time-consuming and requires special knowhow
Solution Approach 1:
The patent replaces subjective human evaluation with automated sensor-based detection systems. Sensors objectively measure laser beam parameters such as focal position, focal diameter, and power distribution, eliminating the need for operator experience and significantly reducing determination time while maintaining or improving measurement accuracy.
Solution Approach 2:
The patent creates digital copies or representations of the laser beam parameters through sensor measurements. Instead of direct subjective assessment, the system captures objective data copies of focal position, focal diameter, and power distribution, enabling rapid automated analysis without requiring special knowhow.
2Measurement precision
If expensive measurement means are used to determine laser parameter changes, then measurement accuracy improves, but cost and complexity increase
Solution Approach 1:
The patent employs relatively simple, cost-effective sensors instead of expensive specialized measurement equipment. The sensor system uses standard optical detectors to measure focal position, focal diameter, and power distribution, providing accurate measurements without requiring complex or costly instrumentation.
Solution Approach 2:
The laser processing machine performs self-diagnosis by using its own sensors to monitor laser beam parameters during operation. The system automatically detects changes in focal position, focal diameter, and power distribution, eliminating the need for external expensive measurement equipment and specialized operators.
3Productivity
If laser processing continues without automated monitoring, then machine uptime is maintained, but quality deterioration goes undetected leading to interruptions
Solution Approach 1:
The patent implements real-time feedback monitoring where sensors continuously measure laser beam parameters during processing. The system compares measured values against reference values and automatically detects deviations in focal position, focal diameter, or power distribution, enabling immediate corrective action before quality deterioration occurs, thus maintaining both uptime and reliability.
Solution Approach 2:
The patent performs preliminary detection of laser parameter changes before they cause processing interruptions. By continuously monitoring focal position, focal diameter, and power distribution, the system identifies trends and alerts operators to potential issues before they affect processing quality, preventing interruptions while maintaining productivity.
Data Source
AI summary
Methods, machines, and computer program products are disclosed for determining the influence of a laser processing parameter on a laser processing operation by means of a laser beam are described. The methods include conducting linear laser processing operations with different values of the laser processing parameter, the speed of advance of the laser beam, respectively, being increased in the laser processing operations at least to such an extent that a processing interruption occurs; and determining a relationship between the processing lengths, the associated processing times, or the associated interruption speeds of the laser processing operations and the laser processing parameter using the measured processing lengths, the associated processing times, or the associated interruption speeds of the laser processing operations.


