Laser Beam Path Layering for Fast, Focused Substrate Processing
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Solution Overview
Problem
Conventional laser processing apparatuses face a trade-off between processing speed and quality due to the limitations of the galvo mirror module's scanning area, where larger areas increase speed but degrade beam focus, and smaller areas improve quality but prolong processing time.
Innovation Solution
A laser processing apparatus with a controller that stratifies targets into multiple beam path layers, allowing the stage to move at a constant velocity along two axes, with the galvo mirror module adjusting the laser beam focus within determined time intervals to maintain high processing speed and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the scanning area of the galvo mirror module is larger, then the processing speed is improved, but the beam focus deformation increases and energy is dispersed
Solution Approach 1:
The patent divides the substrate into multiple processing areas that can be processed in sequence. The galvo mirror module's scanning area is optimized for each individual processing area, maintaining small scanning distances and focused beam quality, while the overall processing speed is improved through efficient area segmentation and sequential processing.
2Manufacturing precision
If the scanning area of the galvo mirror module is smaller, then the beam focus quality is improved, but the processing time is prolonged
Solution Approach 1:
The patent pre-divides the substrate into multiple processing areas and pre-plans the processing sequence. This preliminary arrangement allows the galvo mirror module to operate within its optimal small scanning area for each area while the controller optimizes the overall processing path, preventing idle time and maintaining high processing speed.
Solution Approach 2:
The patent implements dynamic control where the controller adjusts the processing parameters and sequence based on the specific characteristics of each processing area. The system dynamically optimizes the galvo mirror's movement within each area and transitions between areas, maintaining both focus quality and processing efficiency throughout the entire substrate.
3Manufacturing precision
If the stage moves more times to accommodate small scanning area, then the beam focus quality is maintained, but the manufacturing lead time increases
Solution Approach 1:
The patent ensures continuous processing by optimizing the stage movement and galvo mirror operation to minimize idle time. The controller coordinates the stage positioning with the galvo mirror processing, ensuring that the stage is positioned and ready before each processing area is activated, maintaining continuous useful action throughout the substrate processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid processing of substrates with improved quality by optimizing the movement of the stage and galvo mirror module, allowing for higher target processing rates while maintaining focused laser energy.
Implementation Method 1
The galvo mirror module is configured to deflect the laser beam to shift a pointing position of the laser beam relative to the stage
Implementation Method 2
a focusing lens module configured to focus the laser beam
Implementation Method 3
a laser generator configured to output a laser beam
Data Source
AI summary
A laser processing apparatus and a processing method thereof has a laser generator, a stage, a galvo mirror module, a focusing lens module, and a controller. The controller has an arithmetic logic unit for stratifying multiple targets at a substrate into multiple beam path layers. The stage is controlled by the controller to move along a first axis forwardly and backwardly. During each of forward movements and backward movements of the stage, the laser generator and a galvo mirror module are controlled by the controller according to a respective one of the beam path layers for processing the targets stratified in the beam path layer. All the targets at the substrate are processed in sequence while the stage is continuously moving along the first axis forwardly and backwardly. The substrate can be rapidly processed with good processing quality.