Laser-Patterned Conductive Structures for Precise Electrodeposition
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Solution Overview
Problem
Conventional methods for fabricating structures with electrically conductive materials are limited in precision and efficiency, particularly in creating patterns and electrodeposition processes without moving substrates, which hampers the production of complex conductive particles and structures.
Innovation Solution
An apparatus and method utilizing a laser or editing tool to pattern and create cavities on an electrically conductive substrate, allowing for electrodeposition of metals, conducting polymers, and composites, with the ability to perform processes without moving the substrate, using a potentiostat for current control and multiple laser beams for precise manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser direct imaging technology is used with mask mounted on substrate, then patterns can be created in the mask, but the manufacturing precision and efficiency are limited
Solution Approach 1:
The patent replaces conventional mechanical mask mounting and substrate handling systems with a direct laser writing approach on electrically conductive substrates. The laser directly patterns the conductive material without requiring physical masks, eliminating mechanical alignment errors and mask-related precision limitations while significantly improving fabrication efficiency
Solution Approach 2:
The patent utilizes controllable laser parameters (power, pulse duration, wavelength) to precisely regulate the patterning process. By adjusting these parameters, the system achieves high manufacturing precision in creating conductive patterns while maintaining high productivity through optimized processing speeds and reduced step times
2Adaptability or versatility
If substrate movement is required during fabrication processes, then different areas can be processed, but the production of complex conductive particles becomes hampered
Solution Approach 1:
Instead of moving the substrate to process different areas, the patent inverts the approach by keeping the substrate stationary and moving the laser beam to pattern different regions. This inversion enables complex particle fabrication while simplifying the overall process by eliminating substrate handling and repositioning operations
Solution Approach 2:
The patent introduces a stationary electrically conductive substrate as an intermediary platform that receives laser patterns and subsequent electrodeposition. This stationary substrate mediates between the moving laser beam and the electrodeposition process, enabling complex structure fabrication without requiring substrate movement while maintaining operational simplicity
3Manufacturing precision
If conventional electrodeposition processes are used, then conductive materials can be deposited, but precision control over material deposition is limited
Solution Approach 1:
The patent applies local quality by using laser patterning to define precise spatial locations where electrodeposition should occur. The laser creates specific patterns on the conductive substrate that locally control where conductive materials are deposited, achieving high deposition precision without requiring complex apparatus by combining simple laser patterning with standard electrodeposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient fabrication of complex electrically conductive structures with precise control over pattern creation and material deposition, allowing for the production of particles and structures with enhanced conductivity and structural features without substrate movement.
Implementation Method 1
application of an editing tool, such as a laser, for patterning an editable structure that mounted on an electrically conductive substrate. Portions of the editable structure may be removed
Implementation Method 2
allow electrodeposition of metals, conducting polymers, semiconductors, or composites of such materials onto the electrically conductive substrate
Data Source
AI summary
An apparatus and method of fabricating particles composed of metals, conducting polymers, semiconductors, and composites of such materials are provided. The method includes application of an editing tool, such as a laser, for patterning an editable structure that mounted on an electrically conductive substrate. Portions of the editable structure may be removed so as to allow electrodeposition.