Reconfigurable Photonic Chips Using Laser-Patterned Phase-Change Film
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Solution Overview
Problem
Existing silicon-based photonic integrated chips have complex processing technologies with high equipment requirements and are non-reconfigurable once processed, limiting their application scenarios.
Innovation Solution
A reconfigurable photonic integrated chip based on a phase change material film, utilizing a dielectric substrate with a phase change film that changes states under external excitation, processed using femtosecond and continuous lasers to achieve specific phase state distributions, allowing for reversible and stable functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-based photonic integrated chip processing technology is used, then manufacturing compatibility and optical performance are improved, but device complexity and processing difficulty increase
Solution Approach 1:
The patent employs phase change materials (such as GST - Ge2Sb2Te5) that can reversibly transition between crystalline and amorphous states. By controlling the phase state of the material through laser irradiation or electrical heating, the refractive index and absorption coefficient of the optical waveguide are dynamically adjusted, enabling reconfigurable photonic devices without complex multi-layer processing
Solution Approach 2:
The patent introduces dynamic reconfigurability to previously static photonic integrated circuits. The phase change material allows the optical properties to be changed in real-time after fabrication, enabling the same physical structure to perform different functions by simply changing the material phase state through external stimulation
2Adaptability or versatility
If multi-layer structured photonic integrated chip is processed, then functional integration is improved, but processing steps and equipment requirements increase
Solution Approach 1:
The patent uses a single phase change material layer that can serve multiple functions: optical waveguide core, switching element, and modulator. This unified approach eliminates the need for separate functional components and complex multi-layer stacking, reducing manufacturing complexity while maintaining functional integration
3Manufacturing precision
If fixed structure photonic integrated chip is manufactured, then manufacturing precision is improved, but reconfigurability and adaptability deteriorate
Solution Approach 1:
The patent changes the physical parameters (phase state) of the material after the fixed structure is manufactured. The crystalline-amorphous phase transition allows the same physical structure to have different optical properties, achieving reconfigurability without compromising the precision of the fabricated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the processing and enables reconfigurability, achieving desired photonic integrated chip functions through adjustable phase states without the need for complex etching processes, and allows for repeated rewriting of the surface structure.
Implementation Method 1
the phase change material contained in the phase change film presents different states corresponding to different phase states under the action of external excitation
Implementation Method 2
performing irradiation on the phase change film by using femtosecond laser to cause the phase change material contained in the phase change film in the specific area to be transformed from the crystalline state to the amorphous state
Implementation Method 3
performing irradiation on the phase change film by using continuous laser to cause the phase change material contained in the phase change film in the specific area to be transformed from an amorphous state to a crystalline state
Data Source
AI summary
The present invention belongs to the technical field of photonic integrated chips, and more specifically, relates to a reconfigurable photonic integrated chip based on a phase change material film and a processing method therefor. A phase change material film is processed with femtosecond laser and continuous laser to change its surface phase state distribution; and by customizing the number of pulses, power and the like of the laser for processing, and a pattern shape for processing, a specific surface phase state distribution is achieved, so as to achieve the function of a specific photonic integrated chip.