Direct Laser Patterning Sacrificial Layer High Resolution

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current patterning methods, such as photolithography and ink-jet processes, are inefficient in terms of material consumption and resolution, leading to issues like waste and positional errors, making them unsuitable for high-resolution microelectronic device production.

Innovation Solution

A method involving a sacrificial layer on a substrate, where pattern grooves are formed using focused energy beams and filled with a second material, allowing for high-resolution patterning without the need for a mask or a separate donor film, thereby reducing material waste and improving processing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If photolithography is used for pattern formation, then high-resolution patterning can be achieved, but material consumption increases and processing efficiency decreases due to multiple steps and complex processes

Engineering Contradiction:

Improvepattern resolutionVSAvoidprocessing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent extracts and eliminates unnecessary process steps from traditional photolithography, removing the need for photoresist coating, baking, development, and etching steps. Only the essential pattern transfer step remains, achieving high resolution while dramatically improving processing efficiency.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The direct laser writing method serves multiple functions simultaneously: it patterns the photoresist, defines the electrode geometry, and creates the conductive path in a single step, replacing multiple specialized process steps with one universal patterning operation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Loss of substance

If ink-jet process is used for direct pattern formation, then material waste is minimized, but resolution is too low for microelectronic devices

Engineering Contradiction:

Improvematerial wasteVSAvoidpattern resolution

Core Design Contradiction:

Loss of substanceVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical ink-jet deposition system with a laser-based direct writing system that uses photopolymerization to form patterns. This substitution enables high-resolution patterning through optical focusing while maintaining the material efficiency of direct deposition methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If laser patterning with LTHC material is used, then high-resolution patterns can be formed, but functional materials are wasted and material degradation occurs

Engineering Contradiction:

Improvepattern resolutionVSAvoidfunctional material waste

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent performs preliminary patterning of the photoresist layer to define the exact electrode geometry before depositing functional materials. This preliminary action ensures that functional materials are deposited only where needed, eliminating waste and preventing degradation from unnecessary coating and removal steps.

Inventive Principle:

Principle #10Preliminary action

4Manufacturing precision

If mask-based photolithography is used, then high-resolution patterning can be achieved, but device complexity increases and applicability to new designs decreases

Engineering Contradiction:

Improvepattern resolutionVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces static mask-based patterning with dynamic direct laser writing, where the laser beam can be programmatically directed to create any pattern geometry. This dynamic approach eliminates the need for physical mask fabrication and alignment, reducing process complexity while maintaining high resolution and enabling rapid design iteration.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables high-resolution patterning with reduced material consumption and waste, improving processing efficiency and preventing material degradation, making it suitable for microelectronic device production.

Implementation Method 1

a pattern is transferred by laser irradiation

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

an LTHC (light-to-heat conversion) material is coated onto a transfer film

Methodology Applied

Scientific EffectLight-to-heat conversion: Heating

Data Source

PatentUS7510951B2Method for forming high-resolution pattern with direct writing means

Publication Date: 2009.03.31 LG CHEM LTD

AI summary

A patterning method comprising (a) providing a substrate having a sacrificial layer made of a first material, partially or totally formed on the substrate, (b) forming pattern grooves, which are free from the first material and have a line width of a first resolution or lower, on the sacrificial layer by using a first means, by which the sacrificial layer is directly processed to form a line, (c) filling the pattern grooves with a second material to a second resolution by using a second means, to form a pattern of the second material on the substrate. This method provides a high-resolution pattern with little or no waste of the second material, thereby reducing production costs. The method uses first high resolution means, such as focused energy beams of laser, combined with a low resolution means, such as ink-jet, to efficiently provide a high-resolution pattern.