Dual-Camera Laser Processing for Precise PCB Residue Removal
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Solution Overview
Problem
The manual removal of residual photoresist on printed circuit boards is time-consuming and labor-intensive, and often damages other elements, hindering the efficiency of the manufacturing process.
Innovation Solution
A laser processing system equipped with dual image capturing devices and a laser module, where the first device provides a wide field of view for initial scanning and the second device with higher resolution performs precise identification and processing, allowing for automated detection and removal of residues without damaging surrounding components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual inspection and removal of residues is performed, then labor intensity and time consumption increase, but damage to other elements is reduced compared to automated methods
Solution Approach 1:
The patent combines inspection and removal operations into a single integrated automated system. The laser processing system incorporates both imaging devices for detection and laser modules for removal, allowing simultaneous execution of both functions without manual intervention, thereby resolving the contradiction between productivity improvement and operational complexity.
Solution Approach 2:
The patent replaces manual mechanical removal operations with an automated laser-based system. The laser module precisely removes residues through non-contact ablation, eliminating the need for manual mechanical tools that could damage surrounding elements while significantly improving productivity and reducing labor intensity.
2Loss of time
If manual removal methods are used, then time consumption increases, but precision in avoiding damage to other elements is maintained
Solution Approach 1:
The patent implements a feedback mechanism where the imaging device continuously monitors the workpiece surface, identifies residue locations with high precision, and provides real-time feedback to the laser module. This closed-loop control system ensures precise removal of residues while avoiding damage to surrounding elements, simultaneously reducing time loss and maintaining manufacturing precision.
Solution Approach 2:
The patent performs preliminary inspection and identification of residues before removal begins. The imaging system scans the workpiece surface in advance, creates a digital map of residue locations, and plans the laser processing path beforehand. This preliminary action enables precise and rapid removal without time loss, as the system is already positioned and configured for immediate precise processing.
3Productivity
If automated laser processing is implemented, then productivity increases, but system complexity increases
Solution Approach 1:
The patent designs the laser processing system with multi-functionality, where the same platform performs both inspection (through integrated imaging devices) and removal (through laser modules). This universal system handles multiple operations within a single integrated platform, reducing overall system complexity while maintaining high productivity through automation.
4Measurement precision
If high-resolution imaging is used for precise residue identification, then measurement precision improves, but processing time increases
Solution Approach 1:
The patent segments the imaging process into multiple stages with different resolution requirements. A lower-resolution wide-field imaging mode is used for initial scanning and coarse residue location identification, followed by high-resolution imaging only for confirmed residue areas. This segmented approach maintains measurement precision for critical measurements while minimizing overall processing time by avoiding unnecessary high-resolution scanning of entire surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces manpower and time required for residue removal, ensuring the integrity of printed circuit boards and enhancing manufacturing yield by enabling precise and efficient laser processing.
Implementation Method 1
The main control device controls the laser module to perform a laser process on the workpiece based on a result of the feature identification step
Data Source
AI summary
Laser processing equipment includes a base, a platform, a first image capturing device, a main control device, a second image capturing device and a laser module. The platform, the first and second image capturing device and the laser module are arranged on the top surface of the base and are electrically connected with the main control device. The first image capturing device shoots a workpiece and generates a first image. The main control device searches a target area in the workpiece based on the first image, and the target area includes specific features. The second image capturing device shoots the target area and generates a second image. The main control device performs a feature identification step for specific features based on the first or second image and controls the laser module to process the workpiece based on the result of identification. The invention also provides a laser processing method.