Laser Peeling of Flexible Displays Using Segmented Resin Layers
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Solution Overview
Problem
Current methods for manufacturing flexible display devices face challenges in achieving high mass productivity at low cost, high yield, and the ability to use large-sized substrates while ensuring the devices are small, thin, lightweight, non-breakable, and manufactured at low temperatures with a simplified process.
Innovation Solution
A peeling method involving the formation of a resin layer with different thickness regions, irradiation with laser light to separate the transistor from the substrate, and the use of oxide semiconductors to reduce manufacturing complexity and cost, allowing for the formation of a flexible display device with a conductive layer exposed for easy connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser light irradiation is performed on a supporting substrate with a heat-resistant resin layer to peel the resin layer, then the display device can be separated from the substrate, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent extracts the heat-resistant resin layer from the supporting substrate through laser irradiation, allowing the display device to be separated cleanly. The laser selectively removes only the resin layer without damaging other components, simplifying the overall manufacturing process by eliminating the need for complex mechanical peeling mechanisms.
Solution Approach 2:
The patent replaces mechanical peeling methods with laser light irradiation to separate the display device from the supporting substrate. This substitution eliminates complex mechanical systems while achieving effective peeling, reducing manufacturing complexity and cost.
2Productivity
If conventional manufacturing methods are used for flexible display devices, then the devices can be produced, but mass productivity is low and manufacturing costs are high
Solution Approach 1:
The patent forms the heat-resistant resin layer and electronic elements on the supporting substrate before final device assembly. This preliminary arrangement allows for efficient batch processing and simplifies subsequent peeling and assembly steps, thereby improving mass productivity while reducing manufacturing costs.
3Productivity
If large-sized substrates are used for manufacturing, then more devices can be produced per batch, but handling and processing become more difficult
Solution Approach 1:
The patent segments the large substrate into multiple regions, each containing electronic elements that can be independently peeled and transferred. This segmentation allows for easier handling of large-area substrates while maintaining high batch production capacity, as smaller peeled sections can be managed more effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of reliable, flexible, and lightweight display devices with high mass productivity and low manufacturing costs, using large-sized substrates and allowing for curved surfaces, while maintaining low-temperature processing and simplified processes.
Implementation Method 1
irradiating the resin layer with laser light to separate the transistor and the formation substrate
Data Source
AI summary
To provide a peeling method that achieves low cost and high mass productivity. The peeling method includes the steps of: forming a first layer with a photosensitive material over a formation substrate; forming a first region and a second region having a smaller thickness than the first region in the first layer by photolithography to form a resin layer having the first region and the second region; forming a transistor including an oxide semiconductor in a channel formation region over the first region in the resin layer; forming a conductive layer over the second region in the resin layer; and irradiating the resin layer with laser light to separate the transistor and the formation substrate.