Laser Peeling of Magnesium Oxide Single Crystal Substrates
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Solution Overview
Problem
The increasing performance demands of semiconductor devices require more thin and lattice-defect-free magnesium oxide single crystal substrates, which are costly to produce and reuse, especially when using magnesium oxide substrates as base substrates for diamond substrate synthesis.
Innovation Solution
A substrate manufacturing method involving a condenser to non-contactly irradiate a laser beam onto a magnesium oxide single crystal substrate, allowing for planar peeling by forming processing marks through two-dimensional movement, enabling the efficient production of thin magnesium oxide single crystal substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional methods are used to obtain thin magnesium oxide single crystal substrates, then substrate thickness can be reduced, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent replaces conventional mechanical cutting and peeling methods with laser beam processing. The laser beam irradiates the magnesium oxide single crystal substrate to form processing marks that enable controlled peeling, eliminating the need for complex mechanical manufacturing equipment and multi-step mechanical processing procedures.
Solution Approach 2:
The patent changes the physical state and properties of the magnesium oxide substrate through controlled laser irradiation. By adjusting laser parameters (energy density, pulse duration, wavelength) and controlling the formation of processing marks, the substrate undergoes phase changes and structural modifications that enable easy peeling into thin sheets without mechanical contact.
2Ease of manufacture
If magnesium oxide substrates are peeled and reused as base substrates for diamond synthesis, then cost reduction is achieved, but substrate quality and integrity may deteriorate
Solution Approach 1:
The patent applies preliminary laser processing to create specific processing marks and modified layers within the magnesium oxide substrate before peeling. This preliminary action prepares the substrate for controlled separation while preserving the integrity of the peeled thin substrate, ensuring it maintains sufficient quality for reuse as a base substrate for diamond synthesis.
Solution Approach 2:
The laser processing creates localized modifications only in specific regions of the substrate where processing marks are formed. The bulk of the substrate material remains unaffected, preserving its overall quality and structural integrity for reuse, while only the local processed regions undergo changes to facilitate peeling.
3Manufacturing precision
If laser beam is condensed into the inner portion of the single crystal member, then processing marks are formed for planar peeling, but energy consumption and processing time increase
Solution Approach 1:
The patent uses pulsed laser irradiation with periodic on-off cycles to form processing marks. The laser beam is applied in repeated pulses, allowing heat accumulation and phase change to occur progressively through the substrate thickness. This periodic action enables deep penetration and precise mark formation without requiring continuous high-energy irradiation, reducing overall processing time and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the easy and cost-effective production of thin magnesium oxide single crystal substrates with reduced lattice defects, facilitating the reuse of magnesium oxide substrates and contributing to cost reduction in diamond substrate manufacturing.
Implementation Method 1
irradiating a laser beam to a surface of the single crystal member and condensing the laser beam into an inner portion of the single crystal member
Implementation Method 2
sequentially forming processing marks in an inner portion of the single crystal member
Data Source
AI summary
A substrate manufacturing method includes: a first step of disposing a condenser for condensing a laser beam in a non-contact manner on a surface 20r of a magnesium oxide single crystal substrate 20 to be irradiated; and a second step of irradiating a laser beam to a surface of the magnesium oxide single crystal substrate 20 and condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions using the condenser, and at a same time, two-dimensionally moving the condenser and the magnesium oxide single crystal substrate 20 relatively to each other, and sequentially forming processing marks to sequentially allow planar peeling.