Semiconductor Laser Peeling Film With Thermal Diffusion Shielding
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices face challenges in suppressing the degradation of device characteristics during the peeling process, which is necessary for wafer reuse, as the laser peeling method can deteriorate the semiconductor circuit, particularly the memory cell array.
Innovation Solution
The implementation of a peeling layer with a thermal diffusion layer and a blocking layer, where the thermal diffusion layer has a higher coefficient of thermal conductivity than the laser peeling film, and the blocking layer effectively blocks the laser beam from reaching the memory layer, reducing heat propagation and minimizing damage to the semiconductor circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser peeling method is used to separate the first semiconductor substrate for wafer reuse, then productivity is improved through substrate reuse, but the reliability deteriorates due to degradation of device characteristics in the semiconductor circuit
Solution Approach 1:
A peeling layer is introduced as an intermediary between the first semiconductor substrate and the memory cell array. This peeling layer includes a laser peeling film that absorbs laser energy and a thermal diffusion layer that disperses the generated heat, preventing direct thermal damage to the semiconductor circuit while enabling substrate separation for reuse
Solution Approach 2:
The peeling layer is designed with specific thermal properties: the laser peeling film has high laser absorption coefficient while the thermal diffusion layer has high thermal conductivity. By controlling these physical parameters, the system enables effective heat dissipation during laser peeling, protecting the semiconductor circuit from thermal degradation
2Ease of manufacture
If the laser beam is applied to peel the first semiconductor substrate, then the peeling process becomes effective for substrate separation, but the semiconductor circuit deteriorates due to heat propagation from the laser peeling film
Solution Approach 1:
The thermal diffusion layer acts as a heat sink intermediary between the laser peeling film and the memory cell array. It absorbs the heat generated by laser absorption in the peeling film and dissipates it laterally, preventing heat propagation to the sensitive semiconductor circuit
Solution Approach 2:
The peeling layer utilizes thermal effects controlled in reverse: while laser peeling relies on localized heating to create separation, the thermal diffusion layer counteracts this by rapidly conducting heat away, preventing excessive thermal expansion and damage to the underlying circuit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the deterioration of device characteristics, allowing for the reuse of wafers while maintaining the integrity of the semiconductor circuit, thereby reducing manufacturing costs and improving the overall efficiency of the semiconductor device production process.
Implementation Method 1
the thermal diffusion layer has a higher coefficient of thermal conductivity than the laser peeling film
Implementation Method 2
forming a laser peeling film above a first semiconductor substrate (W1)
Data Source
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AI summary
According to one embodiment, a method of manufacturing a semiconductor device includes: forming a laser peeling film above a first semiconductor substrate; forming a circuit layer above the laser peeling film; bonding the first semiconductor substrate and a second semiconductor substrate; applying a laser beam to a back surface of the first semiconductor substrate; and peeling the first semiconductor substrate to maintain the circuit layer on a side of the second semiconductor substrate. Forming the laser peeling film includes forming, inside the laser peeling film, a thermal diffusion layer. The thermal diffusion layer includes a member having a coefficient of thermal conductivity higher than that of the laser peeling film.