Laser-Perforated Flat Products for High-Throughput Microfilters
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Solution Overview
Problem
Current laser drilling methods for creating perforated structures in substrates, such as microfilters, are limited by low production speed and inadequate control over processing quality, especially in series production where high precision and throughput are required.
Innovation Solution
A method and manufacturing system that utilizes a laser processing device with a flat product reservoir and positioning unit, enabling continuous or semi-continuous processing of flat products with pulsed laser beams to form hole openings in a predetermined processing field, allowing for high-speed and high-quality production of perforated structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical drilling is used to create perforated structures, then the process is simple and reliable, but the production speed is low and time expenditure is high
Solution Approach 1:
The patent replaces mechanical drilling systems with a laser processing device that uses pulsed laser radiation to ablate material and create through-openings. This substitution eliminates mechanical contact and wear while enabling high-speed processing through automated laser scanning and pulsing techniques, directly resolving the contradiction between mechanical simplicity and production speed.
Solution Approach 2:
The patent employs periodic pulsed laser radiation where multiple laser pulses are applied in sequence at each processing point. This periodic action allows for controlled material removal through ablation, enabling precise through-opening creation while maintaining high processing speeds through automated pulse sequencing and multi-point parallel processing.
2Manufacturing precision
If laser drilling is used to create perforated structures, then production speed and precision are improved, but control over processing quality is inadequate in series production
Solution Approach 1:
The patent segments the laser beam into multiple independent laser spots that can be positioned at different processing points simultaneously. This segmentation allows parallel processing of multiple through-openings across the substrate, enabling series production while maintaining precise control over each individual opening's quality through independent spot positioning and parameter control.
Solution Approach 2:
The patent implements dynamic control of the laser processing device where the positions, intensities, and timing of multiple laser spots can be adjusted in real-time during processing. This dynamic adaptability allows optimization of processing quality for each specific location while maintaining high overall production throughput through automated sequencing and parameter modulation.
3Manufacturing precision
If high precision laser processing is applied, then manufacturing precision is improved, but the complexity of the processing system increases
Solution Approach 1:
The patent employs a universal laser processing device that can perform multiple functions including positioning, focusing, pulsing, and scanning of laser beams. This multi-functional system achieves high manufacturing precision through integrated control mechanisms that manage spot positioning, pulse timing, and energy distribution, thereby reducing the need for separate specialized devices and limiting overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and high-quality production of perforated flat products suitable for series production, improving processing speed and maintaining necessary quality requirements for applications like microfilters and microsieves.
Implementation Method 1
In pulsed laser ablation, the laser radiation is absorbed by the substrate being processed. The radiation energy can then be converted into heat, for example. Chemical bonds can also be broken as a result of the radiation (so-called chemical ablation). Consequently, the substrate is heated locally within a very short time, and the substrate material is locally melted and vaporized or ionized.
Implementation Method 2
For subtractive processing (such as creating a laser hole), the material being processed must be able to absorb the incident laser radiation (e.g.,the laser radiation emitted by a CO2 or a UV laser) is at least partially absorbed.
Implementation Method 3
Consequently, the substrate is heated locally within a very short time, and the substrate material is locally melted and vaporized or ionized.
Data Source
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AI summary
The present invention relates to a method and manufacturing system for producing a flat product (2) provided with a perforated structure (1). Furthermore, the present invention relates to a flat product (2) obtainable by a method according to the invention. The invention also relates to the use of a flat product (2) produced according to a method according to the invention as a microfilter or microsieve. The method and manufacturing system according to the invention enable the rapid mass production of perforated flat products while ensuring the required quality standards.