Laser Perforation and Offset Ablation for Precision Substrate Features
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Solution Overview
Problem
Current methods for fabricating features in substrates, such as glass, face challenges including long process times, low positional accuracy, and rough sidewalls, which are unacceptable for applications requiring tight tolerances and high-quality features.
Innovation Solution
A hybrid method combining the formation of a perforation contour using a pulsed laser beam to create damage regions and subsequent ablation along an offset track to remove material, achieving high positional accuracy and smooth sidewalls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional drilling methods are used to fabricate features in substrates, then the features can be formed, but the process time is long and positional accuracy is low
Solution Approach 1:
The drilling process is divided into two distinct stages: (1) laser perforation to create initial holes through the substrate, and (2) mechanical reaming to enlarge and precision-finish the holes. This segmentation allows each stage to be optimized independently, achieving both high speed in perforation and high precision in reaming, thereby resolving the contradiction between process time and positional accuracy
Solution Approach 2:
The laser perforation step performs preliminary action by creating initial holes that define the precise positional locations before mechanical reaming. This preliminary positioning ensures that subsequent reaming operations occur at accurately located positions, improving overall positional accuracy while maintaining efficient process timing
2Manufacturing precision
If traditional drilling methods are used to fabricate features in substrates, then the features can be formed, but the sidewalls are rough
Solution Approach 1:
The hole formation process is segmented into laser perforation (creating initial holes) and mechanical reaming (enlarging and finishing holes). The reaming stage specifically addresses sidewall quality by removing rough laser-induced material and creating smooth, precise cylindrical walls, thereby achieving high manufacturing precision without sacrificing productivity
Solution Approach 2:
The mechanical reaming tool acts as an intermediary between the laser perforation process and the final feature requirement. It transforms the rough laser-drilled holes into precision holes with smooth sidewalls, mediating the transition from low-quality to high-quality features while maintaining production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of features with precise positional accuracy, smooth sidewalls, and reduced processing times, suitable for demanding applications with small dimensions and high throughput.
Implementation Method 1
the pulsed laser beam focal line generating an induced absorption within the substrate at each of the locations, the induced absorption producing one of the plurality of perforations
Implementation Method 2
directing an ablation laser beam into the substrate along an ablation track offset from the perforation contour, the ablation laser beam ablating the substrate along the ablation track
Data Source
AI summary
In one embodiment, a method of drilling a feature in a substrate includes directing a pulsed laser beam focal line into the substrate at a plurality of locations, the laser beam focal line generating an induced absorption within the substrate such that the laser beam focal line produces a perforation extending through a thickness of the substrate at the plurality of locations to form a perforation contour. The method further includes directing a focused ablation laser beam into the substrate and ablating at least a portion of the substrate along an ablation track that is offset from the perforation contour by a perforation-ablation offset ΔnP-Ablation to remove substrate material within a shape defined by the perforation contour to form the feature. The perforation-ablation offset ΔnP-Ablation is such that the feature has a chipping with chips having a size of less than 50 μm.