Laser Component With Perpendicular Chips For High Power Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for producing laser components face limitations in achieving high optical power density, leading to increased complexity, cost, and spatial dimensions when combining multiple housings or using compression optical units, which are not sufficient for certain technical applications like projection applications.
Innovation Solution
A laser component design featuring a housing with perpendicular side walls, carrier blocks, and laser chips oriented perpendicular to the base surface, where each carrier block has contact regions electrically connected to contact pins, allowing for parallel arrangement and efficient electrical connections to enhance power density without increasing assembly complexity or size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple housings are combined to achieve higher optical power, then the optical power increases, but the assembly outlay and system complexity increase
Solution Approach 1:
Multiple laser chips are arranged side-by-side within a single housing and electrically connected in parallel, merging their optical output into one integrated unit. This eliminates the need to mechanically combine multiple housings while achieving the same power increase, thereby reducing assembly outlay and system complexity
2Power
If compression optical units are used to increase power density, then the optical power density increases, but the spatial dimensions and system complexity increase
Solution Approach 1:
Laser chips are arranged in a planar side-by-side configuration rather than stacking them vertically or using optical compression along the propagation direction. This lateral arrangement increases power density without requiring additional optical components that would increase spatial dimensions
3Power
If multiple housings are combined to achieve higher optical power, then the optical power increases, but the costs increase
Solution Approach 1:
Multiple laser chips are integrated into a single housing with a unified electrical connection system, eliminating the need to manufacture and assemble multiple separate housing units. This reduces manufacturing costs while achieving the desired optical power output
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves higher optical power density while maintaining a compact and cost-effective system, suitable for applications requiring increased power without the drawbacks of traditional methods.
Implementation Method 1
a first laser chip (101) and a further laser chip (102) which are oriented with their emission direction (131) perpendicular to the base surface (411)
Implementation Method 2
each first contact region (311, 321) and each second contact region (312, 322) comprises a first face (311, 321) and a second face (312, 322), the first face (311, 321) and the second face (312, 322) electrically conductively connected to one another
Data Source
AI summary
A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.