Laser-Phosphor Light Source Layout for Better Heat Dissipation
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Solution Overview
Problem
Conventional light emitting devices with semiconductor laser elements and wavelength converting members suffer from heat accumulation, leading to faster deterioration of both components, as heat dissipation is inhibited, resulting in reduced device lifespan.
Innovation Solution
The design includes semiconductor laser elements emitting light laterally, a reflecting member to redirect light to a wavelength converting member positioned within a radiating body made of materials like metal or ceramic, which enhances heat dissipation by allowing efficient heat release from both the semiconductor laser elements and the wavelength converting member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor laser elements and wavelength converting members are disposed on a base, then light emission function is achieved, but heat dissipation is inhibited leading to component deterioration
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by introducing a hollow cylindrical radiating body that extends vertically from the base. This spatial dimensionality change allows heat to be dissipated through the lateral surface area of the cylinder, significantly increasing the heat dissipation surface area and improving thermal management effectiveness.
Solution Approach 2:
The radiating body is constructed from materials with high thermal conductivity, such as metal or ceramic, which are specifically selected for their superior heat dissipation properties. These composite materials form a dedicated thermal management structure that efficiently conducts heat away from the semiconductor laser elements and wavelength converting members, resolving the heat accumulation problem while maintaining component reliability.
2Temperature
If heat dissipation structure is added to improve heat release, then temperature control improves, but device complexity increases
Solution Approach 1:
The hollow cylindrical radiating body serves multiple functions simultaneously: it acts as a heat dissipation structure for thermal management, provides a mounting support for the semiconductor laser elements and wavelength converting members, and forms part of the overall device housing. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving effective heat dissipation.
3Temperature
If radiating body made of metal or ceramic is used, then heat radiation performance improves, but manufacturing difficulty increases
Solution Approach 1:
The patent specifies that the radiating body should have a thermal conductivity of 10 W/mK or more, providing a clear quantitative parameter for material selection. This parameter-based approach allows manufacturers to choose from a range of suitable materials (metals, ceramics, or composite materials) that meet the thermal performance requirement while considering their respective manufacturing characteristics, thus balancing heat radiation performance with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the deterioration of semiconductor laser elements and wavelength converting members by improving heat radiation performance, thereby prolonging the device's lifespan and maintaining high light extraction efficiency.
Implementation Method 1
a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light that is emitted from the plurality of semiconductor laser elements and reflected upward by the reflecting member
Implementation Method 2
a reflecting member that is disposed on the base and configured to reflect light from the plurality of semiconductor laser elements
Implementation Method 3
a radiating body disposed on the surrounding part, the radiating body comprising at least one of a metal and a ceramic
Implementation Method 4
the radiating body having an opening... effectively suppresses the deterioration of semiconductor laser elements and wavelength converting members by improving heat radiation performance
Data Source
AI summary
A light emitting device includes first and second semiconductor laser elements, a base, a surrounding part, a wavelength converting member, and first and second wiring parts. The first laser element, the converting member and the second laser element are arranged in order in a first direction. At least one of the first and second laser elements is disposed between the first and second wiring parts in a second direction perpendicular to the first direction. An outermost periphery of the converting member is between a first imaginary line and a second imaginary line in the top view. The first and second imaginary lines are both parallel to the second direction. The first imaginary line passes through an outermost periphery in the first direction of the second laser element and the second imaginary line passes through an outermost periphery in a direction opposite to the first direction of the first laser element.