Laser Photonic Chip Integration Spacer Alignment
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Solution Overview
Problem
Direct solder attachment of laser components to photonic chips is hindered by varying temperature requirements and potential contamination risks, making it challenging to achieve precise alignment and minimize footprint in transceivers.
Innovation Solution
The use of spacers, either separate or integrated into the submount, to align and attach the laser to the photonic chip, allowing for edge coupling and reducing the complexity and cost of cavity formation, while maintaining precise alignment with the waveguide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If direct solder attachment is used to attach laser component and electrical chip onto the same photonic chip, then footprint is minimized, but temperature requirements conflict and contamination risk increases
Solution Approach 1:
The patent introduces a submount as an intermediary component between the laser component and the photonic chip. The submount provides separate attachment surfaces that can accommodate different temperature requirements for the laser component and electrical chip, eliminating the contamination risk while maintaining a compact footprint through integrated design.
2Area of stationary object
If direct solder attachment is used to attach laser component and electrical chip onto the same photonic chip, then footprint is minimized, but contamination risk increases
Solution Approach 1:
The submount acts as a protective intermediary that isolates the laser component from the reflow and cleaning processes used for attaching the electrical chip to the photonic chip. This separation eliminates contamination risk while the integrated submount-photonic chip design maintains minimal footprint.
3Manufacturing precision
If spacers are used to align laser with photonic chip, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The patent combines the alignment and attachment functions into a single integrated submount structure. The submount incorporates alignment features directly into its design, eliminating the need for separate spacers while maintaining precise alignment between the laser component and photonic chip through unified manufacturing.
Data Source
AI summary
Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.