Laser Die and Photonics Die Integration via Recess Alignment
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Solution Overview
Problem
Current semiconductor device packaging technologies face challenges in effectively integrating a laser die with a photonics die to enable efficient light emission and modulation for data transmission in photonic systems.
Innovation Solution
A multi-semiconductor device package is created by positioning the laser die relative to the photonics die, engaging alignment features, installing the laser die within a recess of the photonics die, and optically connecting the laser facet with an embedded waveguide, allowing for both electrical and optical interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the laser die is physically attached to the photonics die, then light delivery is direct and efficient, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The laser die is merged with the photonics die through direct physical attachment, combining two separate functional components into a single integrated unit. This merging enables direct light delivery from the laser facet to the waveguide input, eliminating the need for external coupling mechanisms and reducing overall system complexity despite the integrated structure.
Solution Approach 2:
The laser die is positioned within a recess of the photonics die, creating a nested configuration where one component is housed within the structure of another. This nesting approach facilitates direct optical coupling while maintaining a compact form factor and simplifying the overall device architecture.
2Ease of operation
If off-die lasers are used with glass fibers or waveguide materials, then the laser can be positioned separately, but light transmission efficiency decreases and system complexity increases
Solution Approach 1:
The laser source is extracted from the traditional off-die configuration and integrated directly into the photonics die structure. This extraction eliminates the need for external glass fibers or waveguide coupling materials, thereby reducing light transmission losses associated with multiple interfaces and material conversions while maintaining positioning flexibility through the recess structure.
3Manufacturing precision
If alignment features are engaged to position the laser die, then optical connection precision is improved, but the manufacturing process complexity increases
Solution Approach 1:
Alignment features are pre-formed during the fabrication of the photonics die, preparing the mounting surface in advance. This preliminary action ensures that when the laser die is installed in the recess, precise optical alignment is automatically achieved without requiring complex post-assembly adjustment procedures, thereby simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient light modulation and data transmission by ensuring precise alignment and connection between the laser die and photonics die, enhancing the performance of photonic systems in data handling and communication applications.
Implementation Method 1
The laser die generates light and includes a laser facet that emits light from a light emitting surface
Implementation Method 2
The photonics die modulates light emitted from the light emitting surface and includes a device side embedded waveguide optically connected with the laser facet
Data Source
AI summary
A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.