Laser Plasma Pattern Matching for Variable Silicon Workpiece Processing
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Solution Overview
Problem
The variability in characteristics of doped silicon substrates, such as hardness and brittleness, requires frequent adjustments to processing conditions for grinding, cutting, and laser processing, leading to poor productivity and cumbersome workflows.
Innovation Solution
A processing method and apparatus that utilize a pulsed laser beam to generate plasma light patterns, allowing for the determination and recording of appropriate processing conditions based on the substrate's intrinsic wavelength and intensity, enabling the selection of similar patterns for consistent processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing conditions are manually adjusted for each workpiece variation, then processing quality can be maintained, but productivity decreases and work becomes troublesome
Solution Approach 1:
The workpiece itself generates the plasma light pattern that serves as its unique identifier. The system automatically acquires this pattern, compares it with stored patterns, and selects appropriate processing conditions without manual intervention. The workpiece 'services' the identification and selection process by providing its intrinsic plasma signature.
Solution Approach 2:
The system changes the processing parameters (wavelength, intensity) of the laser beam to generate plasma light patterns that reveal the workpiece's intrinsic characteristics. By analyzing these parameter variations in the plasma patterns, the system automatically determines the optimal processing conditions for each workpiece type.
2Reliability
If processing conditions are manually adjusted for each workpiece variation, then appropriate conditions can be found, but the work becomes troublesome and time-consuming
Solution Approach 1:
The system creates optical copies (plasma light patterns) of the workpiece's intrinsic characteristics. These patterns are captured, stored in a database, and used for automatic identification. Instead of manually analyzing workpiece properties, the system uses these light pattern copies to quickly match and select processing conditions.
Solution Approach 2:
The system implements a feedback loop where plasma light patterns from the workpiece are continuously acquired, compared with stored reference patterns, and used to automatically adjust and select processing conditions. This closed-loop feedback eliminates manual trial-and-error adjustment.
3Productivity
If the same processing conditions are applied to all workpieces, then productivity is maintained, but processing quality varies due to workpiece characteristic differences
Solution Approach 1:
The system recognizes that different workpieces have different local qualities (intrinsic characteristics) reflected in their plasma light patterns. Instead of applying uniform processing conditions, it tailors the processing parameters to match the specific characteristics of each workpiece, ensuring optimal quality for each case while maintaining overall productivity through automation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for setting and applying appropriate processing conditions according to the substrate's characteristics, eliminating the need for frequent adjustments and improving productivity by ensuring consistent processing results.
Implementation Method 1
applying, to the workpiece, such a pulsed laser beam as to cause ablation to generate plasma light
Implementation Method 2
generate plasma light and generating a first distribution pattern including a wavelength and intensity of light intrinsic of a substance constituting the workpiece
Data Source
AI summary
A processing method for a workpiece includes applying to the workpiece a pulsed laser beam that causes ablation to thereby generate plasma light and generate a first distribution pattern, the beam having a wavelength and intensity of light intrinsic to the workpiece substance, the beam being used to find and set appropriate processing conditions for processing the workpiece; recording the first distribution pattern and the processing conditions in a linked manner; applying the beam to the workpiece to generate plasma light; generating a second distribution pattern including a wavelength and intensity of light intrinsic to the workpiece substance, according to the plasma light; collating the second distribution pattern and the first distribution pattern to thereby select a third distribution pattern having a degree of similarity in a predetermined range; and processing the workpiece in reference to processing conditions linked to the third distribution pattern.