Laser Diode Platform Integration for Low Thermal Resistance
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Solution Overview
Problem
Existing laser packages face limitations in heat dissipation due to multiple thermal interfaces, which hinder the efficient operation of high-power laser diodes, leading to increased thermal resistance and potential beam clipping issues.
Innovation Solution
The integration of a submount/heat sink into the housing or formation of an electrically conductive contact layer as a single platform with the carrier substrate reduces thermal interfaces, allowing for improved heat dissipation through a single interface and preventing beam clipping by adjusting the platform height and laser diode placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a submount is arranged on a carrier substrate by means of solder compound or sinter paste, then the laser diode can be mounted and electrically connected, but the thermal resistance increases due to multiple thermal interfaces
Solution Approach 1:
The patent merges the submount and carrier substrate into a single integrated component, eliminating the intermediate solder compound or sinter paste layer. This integration removes the additional thermal interface, directly reducing thermal resistance while maintaining electrical connection functionality through the unified structure.
Solution Approach 2:
The patent extracts and eliminates the intermediate solder compound or sinter paste layer from the thermal path between the laser diode and the carrier substrate. By removing this problematic intermediate layer, the thermal resistance is reduced while the essential electrical connection function is preserved through the integrated submount-carrier substrate design.
2Ease of manufacture
If multiple thermal interfaces are used in the laser package, then component mounting and electrical connection are achieved, but heat dissipation efficiency is limited
Solution Approach 1:
The patent combines the submount and carrier substrate into one integrated component, reducing the number of thermal interfaces from multiple to just one (at the laser diode level). This merger maintains ease of manufacture through the integrated design while dramatically improving heat dissipation efficiency by eliminating intermediate thermal barriers.
3Object-affected harmful factors
If the platform height is increased to prevent beam clipping, then the laser facet distance from carrier substrate increases, but the device complexity increases
Solution Approach 1:
The patent integrates the submount and carrier substrate into a single component with a built-in platform structure. This merger eliminates the need for separate height adjustment mechanisms, preventing beam clipping through the integrated platform design while maintaining simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal resistance, enables high-power laser diodes to operate at full optical power, and simplifies manufacturing while preventing beam clipping and enhancing reliability through reduced component complexity.
Implementation Method 1
the heat generated by the laser diode can thus be dissipated into the electrically conductive contact layer or the carrier substrate via only one interface between the platform and the laser diode
Data Source
AI summary
The invention relates to an optoelectronic component including an electrically conductive first contact layer located on a carrier substrate, an electrically conductive platform that is located on the first contact layer and is formed integrally therewith, at least one laser diode that is located on the platform and is electrically connected thereto, and an electrically conductive second contact layer which is electrically coupled to the at least one laser diode. The height of the platform is such that the laser facet of the at least one laser diode is at such a vertical distance from the carrier substrate that a light cone emitted by the laser diode through the laser facet does not strike the carrier substrate within a predefined horizontal distance from the laser facet.