Laser-Assisted Pneumatic Needle Assembly for Damage-Free Chip Transfer
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Solution Overview
Problem
Current Mini/Micro LED chip transfer methods, such as direct needle-punching and spring acupuncture, often damage the fragile light-emitting side of chips, and existing pneumatic systems face issues with bubble rebound and viscosity control, limiting transfer efficiency and yield.
Innovation Solution
A pneumatic chip transfer mechanism using a laser-assisted needle assembly with a hollow cylindrical design, where ultraviolet laser irradiation reduces blue film viscosity, forming well-shaped bubbles to drive chips onto a substrate without damage, ensuring flexible contact and high transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct needle-punching method is used to transfer chips, then transfer efficiency is improved, but chip damage increases due to rigid contact with the fragile light-emitting side
Solution Approach 1:
The patent replaces the traditional mechanical rigid needle-punching system with a pneumatic system that uses gas pressure to deform a flexible film, which then gently pushes the chip. This substitution of mechanical rigid contact with pneumatic flexible contact resolves the contradiction by maintaining transfer efficiency while eliminating chip damage from rigid needle contact with the light-emitting side.
Solution Approach 2:
The patent introduces a flexible film that can be deformed by pneumatic pressure to adapt to the chip shape and provide gentle contact. This flexible film acts as an intermediary that transfers the chip without the rigid contact that causes damage, thus improving chip integrity while maintaining transfer efficiency through the controlled deformation and release mechanism.
2Reliability
If pneumatic transfer with film tension is used, then chip damage is reduced, but transfer efficiency decreases due to slow bubble rebound
Solution Approach 1:
The patent optimizes the film material parameters (viscosity, elasticity) and pneumatic pressure parameters to achieve the right balance. By carefully controlling these parameters, the film provides sufficient gentleness to prevent chip damage while also enabling fast enough rebound to maintain high transfer efficiency. The parameter optimization resolves the contradiction between soft contact and fast rebound.
3Reliability
If blue film viscosity is increased to improve chip adhesion, then transfer yield improves, but bubble formation and rebound performance deteriorates
Solution Approach 1:
The patent precisely optimizes the blue film viscosity parameter to achieve the optimal balance between adhesion and rebound. By controlling the viscosity within a specific range and optimizing the curing parameters, the film provides sufficient adhesion to ensure high transfer yield while maintaining the elasticity needed for fast bubble rebound, thus resolving the contradiction between these two opposing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves high-yield, damage-free transfer of Mini/Micro LED chips with controlled attitude and efficient bubble formation, addressing the limitations of previous technologies by avoiding chip damage and optimizing transfer efficiency.
Implementation Method 1
uses a laser generator to greatly change the performance of a small range of blue film materials
Implementation Method 2
blowing to produce a well-formed bubble, driving the chip to peel off to the target substrate
Data Source
AI summary
This invention introduces a pneumatic chip transfer mechanism for laser ungluing needles in the semiconductor optoelectronic field. It comprises upper and lower platform mobile systems, and a central transfer platform system equipped with a transfer slide, vertical power module, needle clamping bracket, and a laser-assisted needle assembly. This assembly includes a laser section with a window, a pneumatic section with an inlet hole, and a micro-hole needle aimed at the blue film assembly on the lower platform. A camera assembly, laser bracket, and laser generator are also integral parts. The mechanism employs a laser generator to modify blue film material properties, creating a bubble that facilitates chip detachment onto a target substrate. This design ensures efficient, flexible Mini/Micro LED chip transfers, revolutionizing chip detachment methods with its innovative approach to leveraging laser and pneumatic technologies for optimal performance.