Laser Reactive Polymer for Underfill Hydrophilization

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The narrowing gap between semiconductor chips and substrates makes it difficult to perform hydrophilization treatment and form an underfill material layer effectively, as traditional methods face challenges in uniformly modifying the surface hydrophilicity and filling the small gap between the chip and substrate.

Innovation Solution

A method involving the formation of a laser reactive polymer layer on the substrate, followed by irradiation with a laser to introduce hydrophilic functional groups, allowing for the uniform modification of the surface and improved encapsulation material layer formation between the semiconductor device and the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional plasma treatment is used for hydrophilization, then the surface can be modified, but it becomes difficult to perform treatment uniformly in the narrow gap between semiconductor chip and substrate

Engineering Contradiction:

Improveuniformity of hydrophilic modificationVSAvoidgap between semiconductor chip and substrate

Core Design Contradiction:

Manufacturing precisionVSLength of moving object

Solution Approach 1:

The patent replaces traditional plasma treatment (mechanical/physical process) with laser irradiation (optical energy process) to achieve hydrophilic modification. The laser beam can penetrate through the semiconductor chip and directly modify the polymer layer on the substrate, bypassing the limitation of narrow gap access that plagues plasma treatment methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a laser-reactive polymer layer as an intermediary material between the substrate and the semiconductor chip. This polymer layer serves as the target for laser irradiation, converting optical energy into chemical changes (hydrophilic modification) that would otherwise be difficult to achieve in the narrow gap space.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the gap between semiconductor chip and substrate is reduced, then packaging density is improved, but it becomes more difficult to form an underfill material layer in the space

Engineering Contradiction:

Improvepackaging densityVSAvoiddifficulty of forming underfill material layer

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent performs hydrophilic modification of the polymer layer through laser irradiation before applying the encapsulation or underfill material. This preliminary treatment ensures that the surface is pre-conditioned with hydrophilic groups, facilitating better adhesion and uniform distribution of the subsequent material layer, even in the reduced gap space.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If laser irradiation is used to modify the polymer layer, then uniform hydrophilic functional group formation is achieved, but additional process steps are required

Engineering Contradiction:

Improveuniformity of hydrophilic functional group distributionVSAvoidnumber of process steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent utilizes changes in laser parameters (wavelength, power, scanning speed) to optimize the hydrophilic modification process. By carefully controlling these parameters, the process achieves uniform functional group distribution while maintaining efficiency, balancing the added process step against the quality improvement.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures uniform hydrophilic modification and enhances the reliability of semiconductor packages by facilitating better penetration and filling of the encapsulation material, even in tight spaces, thereby improving the manufacturing process for semiconductor packages and package-on-package structures.

Implementation Method 1

irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group

Methodology Applied

Scientific EffectPhotochemical reaction: Photopolymerisation

Data Source

PatentUS11508713B2Methods of manufacturing semiconductor package and package-on-package

Publication Date: 2022.11.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.